Design For Manufacturing Best Practices
By Josh Akman - 12 Nov, 2020 - Comments: 0

Manufacturing issues are one of the top reasons that we see warranty returns and loss of market share in the electronics industry. Issues like supply chain failures and printed circuit board assembly (PCBA) production challenges related to design can lead to irreparable damage to a brand’s reputation. It is therefore critical that companies have a design for manufacturability (DfM) protocol i... » read more

Arm Goes For Performance
By Paul McLellan - 12 Nov, 2020 - Comments: 0

At the recent Linley Processor Conference, Arm presented two processors. This was regarded as so confidential that the original pre-conference version of the presentations didn't contain the Arm one, even though that pdf was only put online about an hour before. But most of the outline of what they presented they already talked about in May, a few months ago. I said recently that this seem... » read more

Probing UPF Dynamic Objects
By Mentor, a Siemens Business - 11 Nov, 2020 - Comments: 0

This paper presents a new low-power verification methodology that makes it possible to continuously monitor the dynamic properties of UPF objects and utilize the information to develop custom low-power verification environments. Based on UPF information model concepts, it allows querying of any dynamic properties of UPF objects through a Tcl API and passing object information on to appropriatel... » read more

Artificial Intelligence For Sustainable And Energy Efficient Buildings
By Fraunhofer IIS/EAS - 11 Nov, 2020 - Comments: 0

According to the goals of Europe’s green deal missions, the continent strives for becoming carbon neutral by 2050. Since buildings are a major contributor to the overall consumption of energy, improving their energy efficiency can be a key to a more sustainable and greener Europe. On the way towards zero-emission buildings, several challenges have to be met: In modern energy systems, several ... » read more

Demystifying MIPI C-PHY / D-PHY Subsystem
By Mixel - 11 Nov, 2020 - Comments: 0

The newest member of the MIPI PHY family, the C-PHY, arrived in October 2014 to a mixture of excitement and apprehension. How would this new C-PHY compare to the MIPI D-PHY and M-PHY? What would differentiate the C-PHY, and would it be compatible enough with the D-PHY so that both could coexist in a hybrid subsystem? Now, years later, the answers are clear. This article will lay out... » read more

Challenges Linger For EUV
By Mark LaPedus - 11 Nov, 2020 - Comments: 2

Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To vie... » read more

The Benefits Of Using Embedded Sensing Fabrics In AI Devices
By Moortec - 11 Nov, 2020 - Comments: 0

AI chips, regardless of the application, are not regular ASICs and tend to be very large, this essentially means that AI chips are reaching the reticle limits in-terms of their size. They are also usually dominated by an array of regular structures and this helps to mitigate yield issues by building in tolerance to defect density due to the sheer number of processor blocks. The reason behind... » read more

Blog Review: Nov. 11
By Jesse Allen - 11 Nov, 2020 - Comments: 0

Mentor's Chris Spear proposes mixing together the compactness of the field macro style with the preciseness of the do methods when writing a UVM transaction class. Cadence's Paul McLellan looks back at the history of EPROM, some of the difficulty with actually erasing it, and the subsequent development of EEPROM. Synopsys' Tuomo Untinen explains three WPA2 authentication vulnerabilities r... » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA
By Ansys - 11 Nov, 2020 - Comments: 0

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Deploying Accurate Always-On Face Unlock
By Arm - 11 Nov, 2020 - Comments: 0

Accurate face verification has long been considered a challenge due to the number of variables, ranging from lighting to pose and facial expression. This white paper looks at a new approach — combining classic and modern machine learning (deep learning) techniques — that achieves 98.36% accuracy, running efficiently on Arm ML-optimized platforms, and addressing key security issues such a... » read more

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