Models Built With Water
By Paul McLellan - 11 Jun, 2020 - Comments: 0

A couple of years ago I wrote a post using the famous quote by statistician George Box: All Models Are Wrong; Some Are Useful. In that post, I discussed paper and plastic airplanes, but mostly I talked about modeling in computers, and especially what I call the "digital illusion." The digital illusion is the idea that signals in digital chips are ones and zeros, with timing, and not analog vol... » read more

ESD Requirements Are Changing
By Bryon Moyer - 11 Jun, 2020 - Comments: 1

Standards for specifying a chip’s ability to withstand electrostatic discharge (ESD) are changing – in some cases, getting tougher, and in others, easing up. ESD protection has been on a path from a one-size-fits-all approach to one where a signal’s usage helps to determine what kind of protection it should get. Protecting chips from ESD damage has been a longstanding part of IC design... » read more

“See No Evil” Shouldn’t Apply To SoC Design
By Tim Penhale-Jones - 11 Jun, 2020 - Comments: 0

In the first part of this blog series, Talking Sense with Moortec…’Are you listening’, I looked at not waiting for hindsight to be wise after the event, instead make use of what’s available and act ahead of time. There’s a Japanese maxim, depicting three ‘wise’ monkeys… Kikazaru, Mizaru, and Iwazaru, better known as ‘hear no evil, see no evil and speak no evil’. If they we... » read more

Preventing Line Change Disruptions With Digital Twins
By Sameer Kher - 11 Jun, 2020 - Comments: 0

During times of crisis, companies can struggle to meet the demand for everyday necessities. Companies need to increase uptime without risking equipment or product quality. During times of crisis, like the COVID-19 pandemic, manufacturing companies can struggle to meet the demand of everyday necessities. We’ve seen this happen in real-time with the shortages of personal protective equipm... » read more

New Approaches For Dealing With Thermal Problems
By Ann Mutschler - 11 Jun, 2020 - Comments: 0

New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal temperatures. This is particularly important in applications such as AI, automotive, data centers and 5G. Heat can kill a chip, but it also can cause more subtle effects such as premature aging... » read more

Using Calibre For Advanced IC Packaging Verification And Signoff
By Mentor, a Siemens Business - 10 Jun, 2020 - Comments: 0

As high density advanced package designs evolve and become more common, an automated LVS-like flow to detect and highlight package connectivity errors is required. We explain the most common package verification issues and how designers can resolve them using using Xpedition Substrate Integrator and Calibre 3DSTACK to provide a significant advantage over traditional LVS flows for HDAP. To re... » read more

How To Design User Equipment Antenna Systems For 5G Wireless Networks
By Ansys - 10 Jun, 2020 - Comments: 0

Next-generation cellular wireless communications will enable numerous innovative, cutting-edge technologies and products. The combination of millimeter-wave (mm-wave) and microwave bands accompanied by advanced spatial multiplexing techniques such as massive multiple-input multiple-output (MIMO) will form the backbone of a new cellular technology called 5G. The evolution to 5G promises low late... » read more

Fundamental Changes In Economics Of Chip Security
By Ed Sperling - 10 Jun, 2020 - Comments: 0

Protecting chips from cyberattacks is becoming more difficult, more expensive and much more resource-intensive, but it also is becoming increasingly necessary as some of those chips end up in mission-critical servers and in safety-critical applications such as automotive. Security has been on the semiconductor industry's radar for at least the past several years, despite spotty progress and ... » read more

Data Will Swamp The Internet, Unless We Think Differently
By Arm - 10 Jun, 2020 - Comments: 0

To harvest the IoT device and data opportunity in the coming years, companies must rethink their infrastructure strategy. This means re-imagining computing from the edge to the cloud. Download this report to see how leading teams are transforming their infrastructure strategies today to win tomorrow. Click here to read more. » read more

Blog Review: June 10
By Jesse Allen - 10 Jun, 2020 - Comments: 0

Cadence's Paul McLellan considers the issues around benchmarking neural networks running on different hardware and challenges in comparing designs. Mentor's Shivani Joshi points to a few of the different types of jitter and some key factors to review when trying to limit jitter. Synopsys' Fred Bals notes that while the National Vulnerability Database is a good source for information on public... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy