Sponsorship Of Women Drives Innovation And Improves Organizational Performance

By SEMI - 15 Apr, 2020 - Comments: 0

Attracting, developing and retaining talent are some of the biggest challenges facing the technology industries, and this is especially true in the semiconductor industry, where the talent gap is widely acknowledged to be growing. Women are under-represented in the workforce of these industries, pointing to a significant opportunity to address these talent challenges. Seeking ways to engage and... » read more

How GaN On SiC Lowers 5G Base Station Costs

By Wolfspeed, a Cree Company - 15 Apr, 2020 - Comments: 0

GaN’s higher efficiency at 5G frequencies compared with LDMOS also means a lower operating cost per bit/second and a lower carbon footprint. Wolfspeed, a Cree company, and dominant player in the GaN on SiC device market, estimates that GaN on SiC can save over 200 W of DC power compared to a system that uses LDMOS power amplifiers (PAs) when operated at maximum average power. Continue read... » read more

Power Becomes Bigger Concern For Embedded Processors

By Ann Mutschler - 15 Apr, 2020 - Comments: 0

Power is emerging as the dominant concern for embedded processors even in applications where performance is billed as the top design criteria. This is happening regardless of the end application or the process node. In some high-performance applications, power density and thermal dissipation can limit how fast a processor can run. This is compounded by concerns about cyber and physical secur... » read more

Blog Review: April 15

By Jesse Allen - 15 Apr, 2020 - Comments: 0

Mentor's Neil Johnson argues that it's time to reevaluate the current definition of verification methodology, with a new focus on methodologies driven by the needs of the design and best suited to different abstractions. Synopsys' Derek Handova warns that the need to manage the security risks of billions of IoT devices will continue to change the requirements and scope of 5G security. Cad... » read more

Manufacturing Bits: April 14

By Mark LaPedus - 14 Apr, 2020 - Comments: 0

Complex microparticles A team of researchers have developed the world’s most complex microparticle. In the lab, researchers have assembled hierarchically organized particles with twisted spikes and polydisperse Au-Cys (gold-cysteine) nanoplatelets or nanosheets. The sheets all twist in the same direction. Cysteine is a proteinogenic amino acid. The structure is said to be more complex ... » read more

Power/Performance Bits: April 14

By Jesse Allen - 14 Apr, 2020 - Comments: 0

Undoped polymer ink Researchers at Linköping University, Chalmers University of Technology, University of Washington, University of Cologne, Chiba University, and Yunnan University developed an organic ink for printable electronics that doesn't need to be doped for good conductivity. "We normally dope our organic polymers to improve their conductivity and the device performance. The proces... » read more

Covid-19 Tech Bits: April 14

By Linda Christensen - 14 Apr, 2020 - Comments: 0

Modeling coronavirus spread Four teams of Finnish researchers have modeled the coughing spread of COVID-19 in tight indoor areas, such as grocery stores and public transportation systems, using a supercomputer and 3D visualization. “The aerosol cloud spreads outside the immediate vicinity of the coughing person and dilutes in the process," said Aalto University Assistant Professor Ville V... » read more

3 Ways To Improve Design Collaboration

By Amit Varde - 13 Apr, 2020 - Comments: 0

In my experience, design engineers are zealous folks who want to extract every ounce of performance out of their design. They continue to make incremental changes to the design until the very end, as close to tape out as possible. Each change made to the design requires corresponding changes to be implemented in the layout. If you are a design engineer, how do you answer this question from y... » read more

NVM Reliability Challenges And Tradeoffs

By Bryon Moyer - 13 Apr, 2020 - Comments: 0

This second of two parts looks at different memories and possible solutions. Part one can be found here. While various NVM technologies, such as PCRAM, MRAM, ReRAM and NRAM share similar high-level traits, their physical renderings are quite different. That provides each with its own set of challenges and solutions. PCRAM has had a fraught history. Initially released by Samsung, Micron, a... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 10 Apr, 2020 - Comments: 0

Market research The coronavirus pandemic continues to reduce the outlook for worldwide GDP as well as the electronics and IC markets. For example, IC Insights has lowered its IC forecast from 3% to minus 4% in 2020. The IC market is now expected to hit $345.8 billion in 2020, which is $39.0 billion less than the original forecast, which called for an 8% increase this year. Due to the imp... » read more

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