Manufacturing Bits: March 31

By Mark LaPedus - 31 Mar, 2020 - Comments: 0

Whiskey webs The production and sale of counterfeit wine and spirits is becoming a big and nefarious business. Using time-lapse microscopy, researchers have developed a way to detect counterfeit whiskey. To detect counterfeit whiskey, the University of Louisville and North Carolina State University have uncovered the mechanism behind what researchers call “whiskey webs.” Whiskey webs... » read more

Power/Performance Bits: March 31

By Jesse Allen - 31 Mar, 2020 - Comments: 0

Tellurium transistors Researchers from Purdue University, Washington University in St Louis, University of Texas at Dallas, and Michigan Technological University propose the rare earth element tellurium as a potential material for ultra-small transistors. Encapsulated in a nanotube made of boron nitride, tellurium helps build a field-effect transistor with a diameter of two nanometers. �... » read more

The Impact Of EUV Resist Thickness On Via Patterning Uniformity

By Benjamin Vincent - 30 Mar, 2020 - Comments: 0

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation during lithography and etch processing. Coventor personnel, in conjunction with our colleagues from ASML and imec, recently looked at the impact of Extreme Ultraviolet lithography (EU... » read more

Medical, Industrial & Aerospace IC Design Changes

By Ann Mutschler - 30 Mar, 2020 - Comments: 0

Medical, industrial and aerospace chips are becoming much more complex as more intelligence is added into these devices, forcing design teams to begin leveraging tools and methodologies that typically have been used only at the leading-edge nodes for commercial applications. But as with automotive, the needs of these systems are changing quickly. In addition to strict quality, safety and sec... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 27 Mar, 2020 - Comments: 0

Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

Week In Review: Auto, Security, Pervasive Computing

By SE Staff - 27 Mar, 2020 - Comments: 0

AI/Edge The United States now has the highest number of COVID-19 cases, and the state governments in the U.S. are asking technologists for help, according to a story in The Washington Post. Data scientists, software developers, and others are needed to help. New York State started a Technology SWAT team calling for help from the tech community. Intel AI Builder program participant DarwinAI ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 27 Mar, 2020 - Comments: 0

Tools & IP Synopsys debuted VIP and a UVM source code test suite for IP supporting Ethernet 800G. The VIP supports DesignWare 56G Ethernet, 112G Ethernet, and 112G USR/XSR PHYs for FinFET processes, which can be integrated for 800G implementations based on 8 lane x 100 Gb/s technology. The VIP can switch speed configurations dynamically at run time and includes a customizable set of frame ... » read more

What’s Changing, What Isn’t

By Ed Sperling - 26 Mar, 2020 - Comments: 0

The global pandemic is creating economic chaos on a global scale. The big question now is when the coronavirus is brought under control, and just how long its effects will extend beyond the current health crisis. For the semiconductor industry, which has weathered many long and deep financial swings, this one at least is finite. When the virus stops spreading, or when treatments are availabl... » read more

Standard Evolution

By Brian Bailey - 26 Mar, 2020 - Comments: 0

I recently had the opportunity to sit down with Lu Dai, chairman of Accellera Systems Initiative and senior director of engineering for Qualcomm. SE: I have noticed a change in the way that Accellera operates these days. In the past, standards were driven by the EDA companies, but recently we have seen a lot more end-user company involvement and they are the companies driving new standards. ... » read more

Physical Verification For Photonics Integrated Circuits

By Manoz Palaparthi - 26 Mar, 2020 - Comments: 0

Silicon photonics is a promising solution for the explosive growth of data volume and network traffic in computing and communications. Silicon photonics integrates photonics applications on a silicon wafer, utilizing mainstream Si-based technology. Photonics integrated circuits (PIC) offer several advantages over traditional integrated circuits: faster data transfer speeds, lower power consumpt... » read more

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