Effective Post-TSV-DRIE Wet Clean Process For Through Silicon Via Applications

By Veeco - 18 Mar, 2020 - Comments: 0

Deep Reactive Ion Etch (DRIE) processes used to form through silicon vias (TSVs) achieve high aspect ratios by depositing polymer on the vertical sidewalls of the features. This polymer material must be removed before other materials (including dielectric liner, Cu barrier, and Cu) are deposited in the TSVs. Clean processes adapted from Cu damascene integration flows use a combination of oxygen... » read more

Designing Resilient Electronics

By Ann Mutschler - 18 Mar, 2020 - Comments: 0

Electronic systems in automobiles, airplanes and other industrial applications are becoming increasingly sophisticated and complex, required to perform an expanding list of functions while also becoming smaller and lighter. As a result, pressure is growing to design extremely high-performance chips with lower energy consumption and less sensitivity to harsh environmental conditions. If this ... » read more

Defect Evolution In Next Generation, Extreme Ultraviolet Lithography

By Coventor - 18 Mar, 2020 - Comments: 1

Extreme ultraviolet (EUV) lithography is a promising next generation lithography technology that may succeed optical lithography at future technology nodes. EUV mask infrastructure and manufacturing of defect-free EUV mask blanks is a key near term challenge in the use of EUV lithography. Virtual fabrication is a computerized technique to perform predictive, three dimensional modeling of sem... » read more

Fast-Charging Technology: The Key To Speeding Electric Vehicle Adoption

By Wolfspeed, a Cree Company - 18 Mar, 2020 - Comments: 0

As the EV market continues to grow and expand, the demand for fast chargers will continue to soar, and the space, efficiency, and system cost gains provided by SiC in various applications will become an increasingly important advantage. Click here to read more. » read more

Thin Film Characterization For Advanced Patterning

By Brewer Science - 18 Mar, 2020 - Comments: 0

Authors: Zhimin Zhu; Xianggui Ye; Sean Simmons; Catherine Frank; Tim Limmer; James Lamb Brewer Science, Inc. (United States) A variable-angle spectroscopic ellipsometer (VASE) is an essential tool for measuring the thickness of a thin film, as well as its n and k optical parameters. However, for films thinner than 10 nm, precise measurement is very challenging. In this paper, the root cause... » read more

Manufacturing Bits: March 17

By Mark LaPedus - 17 Mar, 2020 - Comments: 0

Making MXenes Drexel University and the Materials Research Center in the Ukraine have devised a system for use in making large quantities of MXenes, a promising set of materials used for energy storage and related applications. A class of two-dimensional inorganic compounds, MXenes consist of thin atomic layers. The materials are based on transition metal carbides, nitrides or carbonitrides... » read more

Timing Closure At 7/5nm

By Ed Sperling - 17 Mar, 2020 - Comments: 2

Mansour Amirfathi, director of application engineering at Synopsys, examines how to determine if assumptions about design are correct, how many cycles are needed for a particular operation and why this is so complicated, and what happens if signals get out of phase. » read more

Power/Performance Bits: March 17

By Jesse Allen - 17 Mar, 2020 - Comments: 0

MRAM speed Researchers at ETH Zurich and Imec investigated exactly how quickly magnetoresistive RAM (MRAM) can store data. In the team's MRAM, electrons with opposite spin directions are spatially separated by the spin-orbit interaction, creating an effective magnetic field that can be used to invert the direction of magnetization of a tiny metal dot. "We know from earlier experiments, i... » read more

HBM Issues In AI Systems

By Brian Bailey - 16 Mar, 2020 - Comments: 0

All systems face limitations, and as one limitation is removed, another is revealed that had remained hidden. It is highly likely that this game of Whac-A-Mole will play out in AI systems that employ high-bandwidth memory (HBM). Most systems are limited by memory bandwidth. Compute systems in general have maintained an increase in memory interface performance that barely matches the gains in... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 13 Mar, 2020 - Comments: 0

Market research The coronavirus is having a major impact on the semiconductor, smartphone and related markets. For example, global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year, according to a report from SEMI. But the coronavirus (COVID-19) outbreak has eroded fab equipment spending in China and elsewhere in 2020, according to the rep... » read more

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