The LP R&D Ecosystem


I don’t know about you, but I’m always fascinated to learn new things about chip design. New techniques for power reduction, new ways to use existing tools, new tools in general. Some of this is happening at universities, some in happening in industry consortiums or partnerships, and despite what some people say from time to time, there is still innovation happening within the EDA companie... » read more

Calibrating Electronics Thermal Simulation Models


‘Rubbish In, Rubbish Out’ is a common and well-accepted fact in the world of thermal simulation—actually any type of simulation, for that matter. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. In terms of electronics thermal simulation, the prediction of the internal ... » read more

Postcards From The Edge (Of The Cloud)


The view from the edge of the cloud is pretty spectacular. Out here, there’s endless possibility. But out here on the edge, there’s turbulence, the cold buffeting swirl of today’s engineering challenges. On the edge, some see the Internet of Things (IoT) stalled. I wrote about this last month. The first wave of IoT devices — especially wearables — has quickly commoditized, driven b... » read more

Low Power Trends Toward FinFET


My previous blog, Power Reduction Techniques, covered which low power techniques were applicable for various process nodes, from larger planar CMOS process technologies through finFET. The 16 and 14nm finFET-based process nodes are moving into production this year, and we are seeing many companies rapidly move their designs to finFET. In my last post, I noted some of the reasons why finFET is s... » read more

Applying Lessons Of Mass Production To Verification


I’ve recently been experiencing that time-honored tradition of helping an elderly family member as they go through one surgery after another attempting to restore worn-out, miscellaneous body parts. What’s most surprising, beyond the costs, is that shopping for a knee or disc replacement is much like shopping for a car. Do you go for the high-performance knee, which maybe hasn’t been test... » read more

Low-Power Design Is More Than Just Minimizing Power


Engineers are accustomed to making tradeoffs when designing products — faster and more power-hungry, or slower and lower-power; expensive and durable, or cheap and disposable; and so on. The ongoing list of tradeoffs and subsequent choices that need to be made can sometimes appear quite daunting. This blog discusses how the design of electronic systems in the context of power has expanded bey... » read more

An Update On The IEEE 1801-2013 Unified Power Format Standard


It’s been almost six years since the first IEEE 1801 standard was officially published in March of 2009, but the standard can trace its roots back to years before that date. On May 30, 2013 the IEEE released a press announcement for the most recent version of the standard, IEEE 1801-2013 (a.k.a. UPF 2.1). This brought forward a standard for the industry that is finally backed by all of the ma... » read more

Digital TV: The Need For Speed


With CES just finishing up, I wanted to take a closer look at the changes in the digital TV market, and what affect those changes have on high performance memory and serial links. Just five years ago, the United States made the transition from analog to digital television. At the time, standard definition digital TV was common, with screens that contained 345 thousand pixels per frame. Recen... » read more

Image Sensor And Display Enhancements Drive Low-Cost Smartphone Growth


The low-cost smartphone segment is fueling the growth of the overall smartphone market. Smartphones are being adopted in emerging markets and are displacing feature or basic phones in developed markets. Mobile phone device manufacturers are closing the leadership gap with the No. 1 vendor – Samsung – by competing in both the high-end and low-end smartphone segments. See Table 1. Table ... » read more

IP Design Essentials For Reliability And SoC Integration


IP is integral to every SoC design. The need for ubiquitous connectivity has pushed the threshold for content in SoCs even beyond the tenets of Moore’s Law. Technology scaling has not only enabled the delivery of increased performance and reduced power, but also rich content through the integration of a wide range of IPs such as radio devices, CMOS image sensors, MEMs, etc., into a single ... » read more

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