A Better Path To Better 3D-IC Thermal Modeling


By Andras Vass-Varnai, Lee Wang, John Parry, Byron Blackmore, and Sudarshan Deo In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits has become a make-or-break factor in product success. The traditional approach of treating thermal analysis as an ... » read more

Designing The AI Factories: Unlocking Innovation With Intelligent IP


The rapid evolution of artificial intelligence (AI) is reshaping the technological landscape, driving unprecedented demands on computing infrastructure. At the heart of this transformation lie innovations in intellectual property (IP) that enable scalable, efficient, and performance-driven AI factories. These advancements are central to addressing the technical challenges of modern AI workloads... » read more

Can Today’s Processor Architectures Be More Efficient?


For years, processors focused on performance, and that performance had little accountability to anything else. Performance still matters, but now it must be accountable to power. If small gains in performance result in disproportionate power gains, designers may need to discard such improvements in favor of more power-efficient ones. Although current architectures undergo a steady cadence of... » read more

From Data To Decisions: Exploring Enterprise Digital Thread Strategy And Simulation


By Sanjay Angadi and Matteo Nicolich It’s nice to think that “aha” moments come out of nowhere — that the next big thing is the result of unbridled genius (or plain dumb luck). But in reality, effective, sustainable product development rarely arises from a solitary flash of brilliance. Innovation requires information, context, collaboration, experimentation, and even failure. Usin... » read more

Often Overlooked, PHYs Are Essential To High-Speed Data Movement


Over the past couple of decades, the semiconductor industry has evolved from a supporting role for traditional verticals like mobile, automotive, and PCs to a foundational role in those markets, as well as in AI factories and hyperscale data centers. Underlying this transformation is the physical layer (PHY), which has emerged as a critical enabler for data transfer and communications. The P... » read more

Scaling Real-Time Visitor Ingestion And ML Inference


When SiteMana onboarded a large new publisher, our infrastructure load increased exponentially overnight. Each visitor page view flowed directly into our real-time ingestion pipeline. This rapid traffic caused CPU credits to quickly exhaust on our AWS x86-based t3.medium instances. As a result, performance was throttled at the exact moment we needed stability most. We quickly realized our syste... » read more

When Can I Buy A Chiplet?


One year ago, Semiconductor Engineering conducted its first roundtable to find out the true state of the industry for chiplets. At that event, it was stated that no chiplet had ever been reused in a design for which it was not initially intended. How much has changed over the past year? Returning from last year were Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice... » read more

Finding And Fixing Leakage Between Power Domains


While there are many forms of current leakage in semiconductors, one especially nefarious type of leakage happens between power rails or power domains. Finding inter-domain leakage is vitally important for design reliability, especially in mixed power system design, but it is a known weakness of traditional electronic design automation (EDA) tools. Specialized EDA tools are needed to accurately... » read more

Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY


Introduction  In the ever-evolving landscape of high-performance camera and display technologies, MIPI D-PHY™ and MIPI C-PHY™ specifications continue to lead the charge, setting benchmarks for low power, low latency, and high bandwidth data transmission. Building on the insights from our previous article, “Demystifying MIPI C-PHY/D–PHY Subsystem” – ... » read more

EBook: Optimizing Analog Design With Multiphysics


As technologies like artificial intelligence (AI), 5G, electric vehicles, and high-speed computing continue to advance, analog and mixed-signal (AMS) technologies have become the unsung heroes of next-gen electronics. AMS chips are enabling smarter, faster, and more efficient systems, but traditional design approaches are struggling to keep pace. Interconnect parasitics, power integrity, photo... » read more

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