category: Low Power-High Performance

category: Auto, Security & Edge AI

Data Center Thermal Management Improves
By Karen Heyman - 18 Jul, 2024 - Comments: 0

Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

How Simulation Addresses Hydrogen Fuel Challenges
By Kiyoung Jung - 18 Jul, 2024 - Comments: 0

By Kiyoung Jung and Kyutae Kim Hydrogen has gained the front seat as a fuel for carbon neutrality. The absence of carbon emission at the point of utilization makes it attractive for net-zero initiatives. Hydrogen fuel possesses qualities like higher flame speed (8x higher), lower ignition energy requirements (15x lower), and wider flammability limit (4% to 70%) compared to typical hydrocar... » read more

Rigid-Flex PCB Design Guidelines
By Siemens EDA - 17 Jul, 2024 - Comments: 0

This white paper is designed to guide you through the intricacies of rigid-flex printed circuit board (PCB) design. In today's electronics industry, there has never been more demand for compact, efficient, and versatile PCBs. Rigid-flex technology has emerged as a game-changer, offering engineers the flexibility to design boards that can bend and flex without sacrificing performance or reliabil... » read more

Evolving Edge Computing
By Arm - 17 Jul, 2024 - Comments: 0

Edge computing is a term that has been in use for a long time. Throughout the industry, there are many references to edge and many pre-conceptions about what that might mean. The term ‘edge’ is typically used for devices that exist on the edge of a network and can cover a plethora of use cases, ranging from the router in your house, a smart video camera surveying a parking lot, to a control... » read more

Speed AND Accuracy: First-Of-Its-Kind Broad-Spectrum CFD Solver Built Natively on GPUs
By Ansys - 17 Jul, 2024 - Comments: 0

Since the advent of computational methods to solve physics problems, especially in the realm of fluid dynamics, scientists and engineers have had to balance the need for accurate simulations with faster times to solution — with available computing resources affecting this balance. Now, we introduce to you a new broad-spectrum native GPU solver created by developers at Ansys. Find more i... » read more

Managing kW Power Budgets
By Ed Sperling - 17 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss increasing power demands and how to address it with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice president of engineering at Empower Semiconductor.... » read more

Cadence Janus NoC System IP
By Cadence - 17 Jul, 2024 - Comments: 0

The Cadence Janus Network on Chip (NoC) is a new highly configurable soft IP designed to speed up the system-on-chip (SoC) and full system design cycle by reducing some of the problems associated with large SoCs. With many more processing nodes, as well as memory and I/O nodes designed into the SoC, the interconnect becomes a major design hurdle. Wiring congestion and wire loads introduce ch... » read more

Research Bits: July 16
By Jesse Allen - 16 Jul, 2024 - Comments: 0

Kirigami-inspired mechanical computer Researchers from North Carolina State University developed a kirigami-inspired mechanical computer that uses a complex structure of rigid, interconnected polymer cubes to store, retrieve, and erase data without relying on electronic components. The system uses 1-centimeter plastic cubes, grouped into functional units consisting of 64 interconnected cubes. ... » read more

Startup Funding: Q2 2024
By Jesse Allen - 10 Jul, 2024 - Comments: 0

AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing sp... » read more

Research Bits: July 8
By Liz Allan - 08 Jul, 2024 - Comments: 0

2D TFETS for neuromorphic computing Researchers from the University of California Santa Barbara and Intel Labs used 2D transition metal dichalcogenide (TMD)-based tunnel-field-effect transistors (TFETs) in a neuromorphic computing platform, bringing the energy requirements to within two orders of magnitude (about 100 times) the amount used by the human brain. The 2D TFETs have lower off-sta... » read more

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