category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

A New Playbook For The AI Era
By Ellie Yieh - 21 Nov, 2019 - Comments: 0

It’s Q4 in Silicon Valley, which means that most tech enterprises are in strategic planning mode, taking stock of where they are today and charting a course for where they want to be over the next few years. This year’s Q4 planning cycle needs to be a little different: the opportunities before us are an order of magnitude larger. So are the challenges. To get to where we need to be, our�... » read more

Planning For Panel-Level Fan-out
By Mark LaPedus - 21 Nov, 2019 - Comments: 0

Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Organ-on-Chip Systems Enable Personalized Medicine
By Serena Brischetto - 21 Nov, 2019 - Comments: 0

Healthcare has traditionally focused on one-size fits-all medication to treat populations instead of tailoring treatments to individual patients. Recent advances in stem cell technology allow researchers to create disease models for personalized medicine. SEMI spoke with Thomas Pauwelyn, Postdoctoral Researcher at imec, about trends in medical technology innovation such as organ-on-chip devices... » read more

Using Digital Twins And DL In Lithography
By Ed Sperling - 21 Nov, 2019 - Comments: 0

Leo Pang, chief product officer and executive vice president at D2S, looks at the results of inverse lithography technology at advanced nodes using curvilinear patterns, and how that can be combined with a digital twin and deep learning speed up time to market and reduce cost. » read more

Foldable Phones Bend The Limits Of Technology
By Applied Materials - 21 Nov, 2019 - Comments: 0

After years of discussion about flexible, bendable displays for mobile electronic devices, the first and most logical of these devices, foldable phones, will hit the market this year — along with some as yet unresolved issues and challenges. Early adopters welcome the introduction of such exciting new technologies (figure 1). But from a broad industry standpoint, which mobile phone designs wi... » read more

Manufacturing Bits: Nov. 19
By Mark LaPedus - 19 Nov, 2019 - Comments: 0

World’s lightest foam Lawrence Livermore National Laboratory (LLNL) has developed what researchers say is the world’s lightest gold foam. LLNL has devised gold aerogel foam. The foam is light enough where it could be carried on the back of tiny insects. Applications for the technology include electronics, catalysis, sensors and energy conversion and storage. An aerogel is based on a ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Nov, 2019 - Comments: 0

Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

Manufacturing Bits: Nov. 13
By Mark LaPedus - 13 Nov, 2019 - Comments: 0

Power beams The U.S. Naval Research Laboratory and PowerLight Technologies have demonstrated the ability to transmit energy using a long-range, free-space power beaming system. The system is being developed as part of the Power Transmitted Over Laser (PTROL) project. The system consists of two 13-foot-high towers. One tower consists of 2-kilowatt laser transmitter. The other tower consist o... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Nov, 2019 - Comments: 0

Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the share of semiconductor industry capital spending held by the top five companies was 25%, according to IC Insights. This meant that a number of companies invested and built new fabs during the... » read more

Inspecting, Patterning EUV Masks
By Mark LaPedus - 06 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Thomas Scheruebl, director of strategic business development and product strategy at Zeiss; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What fol... » read more

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