category: System-Level Design

category: Auto, Security & Edge AI

System Bits: Sept. 16
By Ann Mutschler - 16 Sep, 2014 - Comments: 0

Increasing optical storage capacity with holograms Researchers from the University of Cambridge have developed a new method for making multi-colored holograms from a thin film of silver nanoparticles, which they say could greatly increase the storage capabilities of typical optical storage devices. The interference produced by the interaction of light with the nanoparticles allows the holog... » read more

More Than Moore
By Ed Sperling - 15 Sep, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the value of feature shrinks and what comes next with Steve Eplett, design technology and automation manager at [getentity id="22664" e_name="Open-Silicon"]; Patrick Soheili, vice president and general manager of IP Solutions at [getentity id="22242" e_name="eSilicon"]; Brandon Wang, engineering group director at [getentity id="22032" e_name="Cadenc... » read more

The Week In Review: Design
By Ed Sperling - 12 Sep, 2014 - Comments: 0

Tools Synopsys extended its fiber optic systems modeling tool to include multi-stage photonic ICs. The tool models bi-directional signal propagation for both optical and electrical and multi-path interference. Intel made a deeper foray into smart devices at the Intel Developer Forum this week, adding Android developer tools and a developer program to accelerate wearable devices, including a... » read more

Blog Review: Sept. 10
By Ed Sperling - 10 Sep, 2014 - Comments: 0

eSilicon’s Mike Gianfagna is searching for patterns and trends in the industry, ranging from big data and the cloud to the IoT. Check out the four V’s. The market for wearables is gaining momentum. Apple made a huge deal out of its Apple Watch this week, but it wasn’t alone. ARM’s David Maidment is on the ground in Berlin looking at the new gear based on Android. Mentor’s John... » read more

System Bits: Sept. 9
By Ann Mutschler - 09 Sep, 2014 - Comments: 0

First transistor-based flexible device with graphene A flexible display incorporating graphene in its pixels’ electronics has been successfully demonstrated by the Cambridge Graphene Centre and Plastic Logic, the first time graphene has been used in a transistor-based flexible device. The prototype is meant to be a first step towards the wider implementation of graphene and graphene-like ... » read more

Stacked Die Politics, Technology And Tools
By Ed Sperling - 08 Sep, 2014 - Comments: 0

The path to stacking die may look fairly straightforward, but reality is somewhat different. There is a battle raging between foundries and OSATs over who will actually stack and package the die. There is new technology being created that could change the economics of how these die go together. And there is debate about just how ready the tools are to make all of this happen. All of this is ... » read more

The Week In Review: Design
By Ed Sperling - 05 Sep, 2014 - Comments: 0

Tools Mentor Graphics unveiled a hypervisor with configuration, debugging and hardware support. The solution is aimed at a variety of vertical markets, ranging from industrial and medical to consumer electronics. NXP uncorked a passive Inter-Integrated Circuit (I²C) solution for near-field communications tagging, allowing appliances, wearables and consumer electronics to use existing NFC-... » read more

Blog Review: Sept. 3
By Ed Sperling - 03 Sep, 2014 - Comments: 0

Ansys’ Bill Vandermark flags the top five engineering technology articles of the week. A couple of these are unusual, such as e-mailing brain waves, and hoverbikes, which could really improve bike safety—as long as you don’t hit a bird. Synopsys’ Marc Greenberg looks at just how fast DDR4 can run. But what do you call it when you overclock everything? Is that still DDR4? Cadence�... » read more

System Bits: Sept. 2
By Ann Mutschler - 02 Sep, 2014 - Comments: 0

Thinnest semiconductor A team of researchers from the University of Washington, the University of Hong Kong and the University of Warwick have demonstrated that two single-layer semiconductor materials can be connected in an atomically seamless fashion known as a heterojunction, which they expect could be the basis for next-generation flexible and transparent computing, better light-emitting d... » read more

The Week In Review: Design
By Ann Mutschler - 29 Aug, 2014 - Comments: 0

Partnerships With an aim to drive adoption of software testing in Japan, Coverity, a Synopsys company said it has tapped OGIS-RI, a Japan-based distributor of IT solutions to partner with Coverity's software testing platform and OGIS-RI's open source license and vulnerability management tool. Maxscend Technologies has joined CEVA’s CEVAnet partner program and will offer complete solutio... » read more

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