category: Technical Papers

category: Auto, Security & Edge AI

Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition (Penn State, et al.)
By Technical Paper Link - 16 Apr, 2024 - Comments: 0

A new technical paper titled "In-Operando Spatiotemporal Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition" was published by researchers at Pennsylvania State University, Cornell University, Argonne National Lab, Georgia Tech and Forschungsverbund Berlin. Abstract "The drive toward non-von Neumann device architectures has led to an intense focus on ins... » read more

In-Memory Computing: Techniques for Error Detection and Correction
By Technical Paper Link - 16 Apr, 2024 - Comments: 0

A new technical paper titled "Error Detection and Correction Codes for Safe In-Memory Computations" was published by researchers at Robert Bosch, Forschungszentrum Julich, and Newcastle University. Abstract "In-Memory Computing (IMC) introduces a new paradigm of computation that offers high efficiency in terms of latency and power consumption for AI accelerators. However, the non-idealities... » read more

Hardware Fuzzer Utilizing LLMs
By Technical Paper Link - 12 Apr, 2024 - Comments: 0

A new technical paper titled "Beyond Random Inputs: A Novel ML-Based Hardware Fuzzing" was published by researchers at TU Darmstadt and Texas A&M University. Abstract "Modern computing systems heavily rely on hardware as the root of trust. However, their increasing complexity has given rise to security-critical vulnerabilities that cross-layer at-tacks can exploit. Traditional hardware ... » read more

High-NA EUVL: Automated Defect Inspection Based on SEMI-SuperYOLO-NAS
By Technical Paper Link - 10 Apr, 2024 - Comments: 0

A new technical paper titled "Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS" was published by researchers at KU Leuven, imec, Ghent University, and SCREEN SPE. Abstract "Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufac... » read more

Chiplet Hardware Security Module To Mitigate Security Vulnerabilities In SiP Systems (Univ. of Florida)
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration" was published by researchers at University of Florida (Gainesville). Abstract: "The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified syst... » read more

Comparison Of The Meta Modeling Approach With HGLs
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "The Argument for Meta-Modeling-Based Approaches to Hardware Generation Languages" was published by researchers at Infineon Technologies and TU Munich. Abstract "The rapid evolution of Integrated Circuit (IC) development necessitates innovative methodologies such as code generation to manage complexity and increase productivity. Using the right methodology for g... » read more

Using Palladium To Address Contact Issues Of Buried Oxide Thin Film Transistors
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Approach to Low Contact Resistance Formation on Buried Interface in Oxide Thin-Film Transistors: Utilization of Palladium-Mediated Hydrogen Pathway" was published by researchers at Tokyo Institute of Technology and National Institute for Materials Science (NIMS). Abstract "Amorphous oxide semiconductors (AOSs) with low off-currents and processing temperatures... » read more

3-Channel Package-Scale Galvanic Isolation Interface for SiC and GaN Power Switching Converters
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers" was published by STMicroelectronics and DIEEI, Università di Catania. Abstract "This article presents the design of a three-channel package-scale galvanic isolation interface for SiC and GaN power switching converters. The isolation interface consists of two side-by-sid... » read more

2D van der Waals Magnets Above Room Temperature (MIT)
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Field-free deterministic switching of all–van der Waals spin-orbit torque system above room temperature" was published by researchers at MIT, with funding by the NSF and U.S. Department of Energy. Abstract "Two-dimensional van der Waals (vdW) magnetic materials hold promise for the development of high-density, energy-efficient spintronic devices for memory an... » read more

Low-Overhead Fault-Tolerant Quantum Memory (IBM)
By Technical Paper Link - 07 Apr, 2024 - Comments: 0

A new technical paper titled "High-threshold and low-overhead fault-tolerant quantum memory" was published by researchers at IBM Quantum. Abstract "The accumulation of physical errors prevents the execution of large-scale algorithms in current quantum computers. Quantum error correction promises a solution by encoding k logical qubits onto a larger number n of physical qubits, such t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy