category: Top Stories

category: Auto, Security & Edge AI

Supporting LP In New Process Nodes
By Ann Mutschler - 10 Jul, 2014 - Comments: 0

Manufacturing process nodes and EDA tools are advancing all the time, but not always utilized at the same pace. And from a tools perspective, there are challenges to supporting low power in new process nodes while maintaining and improving the existing process nodes. One way design teams address this is by leveraging the most advanced software on the less-than-bleeding edge designs. To th... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

28nm FinFETs?
By Brian Bailey - 10 Jul, 2014 - Comments: 5

One star of the upcoming 14/16nm process node is the introduction of the finFET, a fundamentally new transistor that overcomes many of the limitations associated with planar transistors. While these devices are more complex to construct—and the physical extraction processes associated with them is more complex due to an increased number of resistances and capacitances—they are seen as a tra... » read more

Tougher Memory Choices
By Brian Bailey - 23 Jun, 2014 - Comments: 1

In part 1 of this roundtable, the participants talked about the investments being made in memory technologies, the role that memories play in system security and the tools support for optimizing memory architecture. Taking part in the conversation are Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technolog... » read more

Do SoCs Need Earthquake Insurance?
By Ann Mutschler - 13 Jun, 2014 - Comments: 1

RTL sign-off is not a new term, but with SoCs that can be comprised of up to 90% IP blocks combined with the complexities that advanced manufacturing process nodes bring, RTL sign-off activities become a process that demands a more comprehensive approach. “There is a fundamental shift going on in chip design in general in that there is a bigger focus on so-called system on chip (SoC) desig... » read more

What Exactly Is The IoT?
By Ed Sperling - 12 Jun, 2014 - Comments: 0

The Internet of Things has drawn its share of attention. It has been overhyped, derided, and in some cases dismissed as the Internet of Silos. But the idea persists, and it’s catching on. So how much substance is there behind the hype? Best guess: Quite a bit. “We do see this as being a fast-growing market,” said Jim Feldhan, president of Semico Research. “The number of connected ... » read more

S-L Power Modeling Gains Steam
By Ann Mutschler - 12 Jun, 2014 - Comments: 1

Power analysis, architectural exploration and optimization of an SoC is a hot topic of discussion today. It is well accepted this must be addressed at a higher level of abstraction because not just the hardware must be taken into account with power intent and power management structures. It has to be viewed from a system point of view, as well, where the hardware resides along with the opera... » read more

Tougher Memory Choices
By Brian Bailey - 12 Jun, 2014 - Comments: 1

Memories have become a hot topic, so Semiconductor Engineering sat down with experts during DAC to discuss some of the issues. Taking part in the conversation were Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technology officer for Atrenta; Patrick Soheili, vice president and general manager for IP Soluti... » read more

What’s Wrong With Power Signoff
By Ed Sperling - 12 Jun, 2014 - Comments: 0

Reducing power has emerged as the most pressing issue in the history of technology. On one hand, it’s the biggest opportunity the electronics industry has ever seen. On the other, the abuse of cheap power has been linked to global warming, human catastrophe, and geopolitical strife. In all cases, the semiconductor increasingly finds itself at the vortex of all of this, and making chips more e... » read more

Beyond The DAC Keynote
By Brian Bailey - 12 Jun, 2014 - Comments: 1

The Design Automation Conference is split into a number of tracks, such as IP, automotive, embedded software and security, and these overlay the main EDA track. One of these themes overlays the first day of DAC, and this year that honor goes to IP. That means that the first keynote of the conference comes from the IP industry, and this is rather fitting given the importance IP is having for ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy