Transforming Silicon Bring-Up


Not too long ago, the return of first silicon from the foundry was a nail-biting moment as power was applied to the chip. Today, better verification methodologies, increased use of emulation, and more mature fabrication practices have transformed how teams utilize first silicon. It is about to be transformed again, and there are some interesting possibilities on the horizon. Much of what use... » read more

Thoroughly Verifying Complex SoCs


The number of things that can go wrong in complex SoCs targeted at leading-edge applications is staggering, and there is no indication that verifying these chips will function as expected is going to get any easier. Heterogeneous designs developed for leading-edge applications, such as 5G, IoT, automotive and AI, are now complex systems in their own right. But they also need to work in conju... » read more

Optimizing Hardware Faster


Maximillian Odendahl, CEO of Silexica, sat down with Semiconductor Engineering to talk about high-level synthesis and the changing role of this technology. What follows are excerpts of that conversation. SE: What is the direction that high-level synthesis is heading in? Odendahl: The direction hasn’t changed, but in the past HLS was not usable by the software guys. The main push right n... » read more

Portable Stimulus And Digital Twins


It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with  Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemens Business; Tom Anderson, technical marketing consultant for OneSp... » read more

RISC-V Markets, Security And Growth Prospects


Semiconductor Engineering sat down to discuss open instruction set hardware with Ben Levine, senior director of product management in Rambus' Security Division; Jerry Ardizzone, vice president of worldwide sales at Codasip; Megan Wachs, vice president of engineering at SiFive; and Rishiyur Nikhil, CTO of Bluespec. What follows are excerpts of that conversation.  Part one of this discussion is ... » read more

Service Revenue Growing With Chip Complexity


Rising complexity, new markets, and a shortage of in-house expertise are beginning to rekindle demand for services for the first time in nearly a decade. The semiconductor industry has been racing to design chips for a variety of new and existing applications, but they are facing challenges on a number of fronts: Leading-edge chips require new architectures due to a sharp reduction in s... » read more

Migrating 3D Into The Mainstream


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

Rapid Evolution For Verification Plans


Verification plans are rapidly evolving from mechanisms to track verification progress into multi-faceted coordination vehicles for several teams with disparate goals, using complex resource management spread across multiple abstractions and tools. New system demands from industries such as automotive are forcing tighter integration of those plans with requirements management and product lif... » read more

Utilizing Computational Memory


For systems to become faster and consume less power, they must stop wasting the power required to move data around and start adding processing near memory. This approach has been proven, and products are entering the marketplace designed to fill a number of roles. Processing near memory, also known as computational memory, has been hiding in the shadows for more than a decade. Ever since the... » read more

IP Management And Development At 5/3nm


The growing complexity of moving to new process nodes is making it much more difficult to create, manage and re-use IP. There are more rules, more data to manage, and more potential interactions as density increases, both in planar implementations and in advanced packaging. And the problems only get worse as designs move to 5nm and 3nm, and as more heterogeneous components such as accelerato... » read more

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