category: Top Stories

category: Auto, Security & Edge AI

Advanced Packaging Options Increase
By Ed Sperling - 19 Aug, 2019 - Comments: 0

Designing, integrating and assembling heterogeneous packages from blocks developed at any process node or cost point is proving to be far more difficult than expected, particularly where high performance is one of the main criteria. At least part of the problem is there is a spectrum of choices, which makes it hard to achieve economies of scale. Even where there is momentum for a particular ... » read more

GaN Versus Silicon For 5G
By Kevin Fogarty - 15 Aug, 2019 - Comments: 0

The global race to launch 5G mmWave frequencies could provide a long-anticipated market opportunity for gallium nitride (GaN) as an alternative to silicon. GaN is more power-efficient than silicon for 5G RF. In fact, GaN has been the heir apparent to silicon in 5G power amplifiers for years, especially when it comes to mmWave 5G networks. What makes it so attractive is its ability to efficie... » read more

The Next New Memories
By Mark LaPedus - 15 Aug, 2019 - Comments: 2

Several next-generation memory types are ramping up after years of R&D, but there are still more new memories in the research pipeline. Today, several next-generation memories, such as MRAM, phase-change memory (PCM) and ReRAM, are shipping to one degree or another. Some of the next new memories are extensions of these technologies. Others are based on entirely new technologies or involve ar... » read more

Wanted: More Fab Tool Part Standards
By Mark LaPedus - 15 Aug, 2019 - Comments: 0

As chipmakers ramp up the next wave of processes and grapple with how to reduce defect levels, they are encountering problems from an unlikely source—components inside of the fab equipment. Defects are unwanted deviations in chips, which impact yields and device performance. Typically, they are caused by an unforeseen glitch during the process flow. But a lesser-known problem involves defe... » read more

Power Modeling Standard Released
By Brian Bailey - 14 Aug, 2019 - Comments: 0

Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

U.S. Consortium Pulls Ecosystem Into Quantum
By SE Staff - 12 Aug, 2019 - Comments: 0

Quantum computing promises to solve impossibly complex problems that no classical computer could solve, and do it in a humanly reasonable amount of time. The hitch is that quantum computers are still in the early development phase. Whether these computers can fulfill that promise is not yet known. Despite the uncertainty, no one wants to be left behind. That includes governments, which are w... » read more

Debug Tools Are Improving
By Brian Bailey - 12 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. Part two... » read more

Optimizing Power For Learning At The Edge
By Brian Bailey - 08 Aug, 2019 - Comments: 0

Learning on the edge is seen as one of the Holy Grails of machine learning, but today even the cloud is struggling to get computation done using reasonable amounts of power. Power is the great enabler—or limiter—of the technology, and the industry is beginning to respond. "Power is like an inverse pyramid problem," says Johannes Stahl, senior director of product marketing at Synopsys. "T... » read more

Determining Where Power Analysis Matters Most
By Ann Mutschler - 08 Aug, 2019 - Comments: 0

How much accuracy is required in every stage of power analysis is becoming a subject of debate, as engineering teams wrestle with a mix of new architectures, different use cases and increasing pressure to get designs out on time. The question isn't whether power is a critical factor in designs anymore. That is a given. It is now about the most efficient way to tackle those issues, as well as... » read more

HBM2E: The E Stands for Evolutionary
By Andy Patrizio - 08 Aug, 2019 - Comments: 2

Samsung introduced the first memory products in March that conform to JEDEC’s HBM2E specification, but so far nothing has come to market—a reflection of just how difficult it is to manufacture this memory in volume. Samsung’s new HBM2E (sold under the Flashbolt brand name, versus the older Aquabolt and Flarebolt brands), offers 33% better performance over HBM2 thanks to doubling the de... » read more

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