category: Top Stories

category: Auto, Security & Edge AI

Power Moves Up To First Place
By Ed Sperling - 10 Apr, 2014 - Comments: 2

Virtually every presentation delivered about semiconductor design or manufacturing these days—and every end product specification that uses advanced technology—incorporates some reference to power and/or energy. It has emerged as the most persistent, most problematic, and certainly the most talked about issue from conception to marketplace adoption. And the conversation only grows louder... » read more

Executive Insight: Simon Davidmann
By Brian Bailey - 10 Apr, 2014 - Comments: 0

Every industry has some colorful characters and within the EDA industry, Simon Davidmann is certainly one that comes to mind. For the past 30-something years, Davidmann has provided guidance to the industry, stood up for what he believes in, been an inspiration to many entrepreneurs, and had some fun along the way. Simon is a serial entrepreneur, angel investor and he has been a key person invo... » read more

The New Face Of MCUs
By Ann Mutschler - 10 Apr, 2014 - Comments: 0

For years, the humble microcontroller was known as the workhorse of white goods and other embedded applications that required some amount of processing, but not as much as a microprocessor would provide. Much has changed since then. Today’s MCUs are the star components in fast-growing and increasingly sophisticated application areas such as automotive, smartphones and the Internet of Thing... » read more

Pain Management
By Ed Sperling - 10 Apr, 2014 - Comments: 0

In part one of this series, the focus was on overlapping and new pain points in the semiconductor flow, from initial conception of what needs to be in a chip all the way through to manufacturing. Part two looks at how companies are attempting to manage that pain. It’s no secret that [getkc id="81" kc_name="SoC"]s are getting more complicated to design, debug and build, but the complexity i... » read more

High Level Synthesis: Significant Differences Remain
By Brian Bailey - 09 Apr, 2014 - Comments: 1

In part 1 of this experts series on high-level synthesis (HLS), Semiconductor Engineering sat down with Mike Meredith, vice president of technical marketing at Cadence/Forte Design Systems; Mark Warren, Solutions Group director at Cadence; Thomas Bollaert, vice president of application engineering at Calypto; and Devadas Varma, senior director at Xilinx. The initial part of the discussion looke... » read more

Micro-Power Energy Harvesting
By Ernest Worthman - 07 Apr, 2014 - Comments: 3

Since the beginning of the human race’s self-awareness, people have strived to harness the planet’s free energy sources; wind, solar, thermal and hydro. On a macro scale, man’s dreams have come to fruition. The next frontier is capturing energy on a micro scale. On the macro front, there are massive corridors of energy powered by wind and solar developments, which generate megawatts of... » read more

Big Shift In SoC Verification
By Ed Sperling - 31 Mar, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss software-driven verification with Ken Knowlson, principal engineer at Intel; Mark Olen, product manager for the Design Verification Technology Division of Mentor Graphics; Steve Chappell, senior manager for CAE technology and verification at Synopsys; Frank Schirrmeister, group director for product marketing of the System Development Suite at Cadenc... » read more

New Approaches For Reliability
By Ed Sperling - 28 Mar, 2014 - Comments: 0

The definition of reliability hasn’t budged since the invention of the IC, but how to achieve it is starting to change. In safety-critical systems, as well as in markets such as aerospace, demands for reliability are so rigorous that they often require redundant circuitry—and for good reason. A PanAmSat malfunction in 1998 caused by tin whisker growth wiped out pagers for 45 million use... » read more

How Much Will That Chip Cost?
By Ed Sperling - 27 Mar, 2014 - Comments: 1

From the most advanced process nodes to the trailing edge of design there is talk about the skyrocketing cost of developing increasingly complex SoCs. At 16/14nm it’s a combination of multi-patterning, multiple power domains and factoring in physical and proximity effects. At older nodes, it’s the shift to more sophisticated versions of the processes and new tools to work within those proce... » read more

EDA Shapes Its Future
By Brian Bailey - 27 Mar, 2014 - Comments: 2

In part one of this series, Semiconductor Engineering looked at growth within the EDA industry and the types of approaches being made to expand the scope of the markets that they serve. Scope expansion comes from the creation of new tools, the growth of companies in the IP space and the various ways in which opportunities can be found in new markets. Additional growth opportunities come from so... » read more

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