category: Top Stories

category: Auto, Security & Edge AI

Distortion Effects Prevail In RF Design
By Ann Mutschler - 27 Mar, 2014 - Comments: 0

It’s an exciting time for consumers of wireless devices, but it’s a challenging time for system designers who must design, analyze and verify that all of the components in those wireless devices interoperate. In wireless designs, distortion effects play an important role in the performance of RF circuits, including mixers, low-noise amplifiers (LNAs) and power amplifiers (PAs) and managi... » read more

Biggest Verification Mistakes
By Ann Mutschler - 27 Mar, 2014 - Comments: 0

[getkc id="81" kc_name="SoC"]s today have more processors and more embedded software than ever, including drivers and middleware just to get the hardware working. This, in turn, requires more and better [getkc id="10" kc_name="verification"]. Add to the challenge the fact that there is no one way to do verification and it is easy to comprehend how critical it is to for hardware and software tea... » read more

Formal Is Set To Overtake Simulation
By Brian Bailey - 27 Mar, 2014 - Comments: 4

There has been a significant psychology change in the area of formal verification over the past couple of years. It’s no longer considered a fringe technology, and it’s no longer considered difficult to use. In fact, it has become a necessary part of the verification process. Semiconductor Engineering sat down with a panel of experts to find out what caused this change and what more we c... » read more

Synopsys-Coverity Deal Final
By Ed Sperling - 26 Mar, 2014 - Comments: 2

Synopsys’ acquisition of Coverity, which makes tools for testing and analyzing software, was made official yesterday. Now what? That may be the $334 million question, which is the price Synopsys paid for the 11-year-old software tools vendor. Even Synopsys’ top executives are rather candid in their uncertainty about where this deal will lead, and they made no qualms about that at the Syn... » read more

Challenges In 3D Resists
By Katherine Derbyshire - 24 Mar, 2014 - Comments: 2

3D integration straddles the line between CMOS fabs and packaging and assembly houses. Depending on the structure being fabricated, the most appropriate process might be more “CMOS-like” or more “package-like.” For example, in CMOS fabs lithography means spin-on photoresist, exposed by a high precision stepper. Inherent in this approach is an assumption that the wafer surface is flat... » read more

Mentor Buys Berkeley Design
By The SE Staff - 21 Mar, 2014 - Comments: 0

Mentor Graphics announced today that it has acquired Berkeley Design Automation, staking a claim on the expanding market for analog, mixed-signal and RF verification. The deal puts Mentor on firm footing against Synopsys and Cadence, just as the opportunity for the Internet of Things (IoT), including automotive and medical design, begins to show real promise. Until this move, Mentor has larg... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Enabling Test Portability With Graphs
By Ann Mutschler - 20 Mar, 2014 - Comments: 0

Is it time to move up again? When it comes to test portability between simulation, emulation, prototypes and silicon, as well as an easier way to create a test structure, the answer appears to be a resounding ‘Yes.’ Looking at these activities from a higher level of abstraction and using a graph-based approach should allow automation where there has been none previously, and could allow val... » read more

EUV Reaches A Crossroads
By Mark LaPedus - 20 Mar, 2014 - Comments: 3

[gettech id="31045" comment="EUV"] (EUV) [getkc id="80" comment="lithography"] is at a crossroads. 2014 represents a critical year for the technology. In fact, it may answer a pressing question about EUV: Does it work or not? It’s too early to make that determination right now, but there are more uncertainties than ever for the oft-delayed technology. Originally aimed for the 65nm node in... » read more

Test Challenges Rising For Mobile Devices
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

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