category: Top Stories

category: Auto, Security & Edge AI

New Approaches To Better Performance And Lower Power
By Ed Sperling - 11 Jul, 2013 - Comments: 0

By Ed Sperling Until 90nm, every feature shrink and rev of Moore’s Law included a side benefit of better power and performance. After that, improvements involved everything from different back-end processes to copper interconnects and transistor structures. But from 20nm onward, the future will rest with a combination of new materials, new architectures and new packaging approaches—and som... » read more

Faster IP Integration
By Ed Sperling - 03 Jul, 2013 - Comments: 0

By Ed Sperling System-Level Design sat down with Laurent Moll, chief technology officer at Arteris, to talk about interoperability, complexity and integration issues. What follows are excerpts of that conversation. SLD: What’s the big challenge with IP? Moll: Interoperability is always a concern. Because of ARM’s dominance, a lot of people are moving to AMBA protocols, whether that’... » read more

New Reliability Issues Emerge
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ed Sperling Most consumers define reliability by whether a device turns on and works as planned, but the term is becoming harder to define as complexity increases and systems are interconnected. Adding more functionality in less space has made it more difficult to build complex chips, and it has made it more difficult to prevent problems in those chips. Verification coverage is a persist... » read more

The Ubiquitous GPU
By Ann Mutschler - 27 Jun, 2013 - Comments: 0

By Ann Steffora Mutschler No matter the application area, GPUs are likely playing a role like never before—even to accelerate EDA software algorithms. It’s no wonder given the ability of GPUs to handle parallel processing much more effectively than CPUs. And when coexisting in a heterogeneous system, GPUs allow the design team to maximize efficiency and performance by allocating tasks... » read more

The New Verification Landscape
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ann Steffora Mutschler Verification technologies and tools have never been more sophisticated. But putting together a methodology is more than just putting tools together. It starts with trying to get a handle on the complexity, knowing what to test, how to test and when. “UVM was standardized and people have been working to adopt that which has been generally a positive,” said Steve Ba... » read more

Memory Gets Smarter
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ed Sperling Look inside any complex SoC these days and the wiring congestion around memory is almost astounding. While the number of features on a chip is increasing, they are all built around the same memory modules. Logic needs memory, and in a densely packed semiconductor, the wires that connect the myriad logic blocks are literally all over the memory. This is made worse by the fact ... » read more

De-Mystifying The SoC Supply Chain
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Barbara Jorgensen At the heart of every supply chain operation is the desire to mitigate risk. In theory, a supply chain allows a customer to leverage the best of the best in technology, logistics or production at a lower cost than DIY (do it yourself.) The system on chip (SoC) supply chain is no different—there’s a whole ecosystem in the semiconductor industry that supports design, pro... » read more

Medical Drives Boom In MEMS
By Ed Sperling - 20 Jun, 2013 - Comments: 0

By Mark LaPedus At a recent event, an executive from a startup called Proteus Digital Health described the medical benefits of swallowing the company’s ingestible sensors or digital pills. First, a consumer would swallow Proteus Digital’s tiny ingestible sensor, along with one’s current medication. With no battery or antenna, the stomach fluid generates the power in the ingestible sen... » read more

Inside A 450mm Metrology Consortium
By Mark LaPedus - 20 Jun, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 450mm metrology challenges with Menachem Shoval, a former manufacturing executive at Intel and chairman of the Metro450 consortium. The Israeli-based consortium is developing metrology technology for the next-generation, 450mm wafer size. The group consists of Intel, Applied Materials, Jordan Valley, Nanomotion, Nov... » read more

Merchant Photomask Makers Remain Relevant
By Jeff Chappell - 20 Jun, 2013 - Comments: 0

By Jeff Chappell For many years the trend in the semiconductor industry with regard to photomasks and chipmakers was to shed captive mask operations in favor of merchant photomask suppliers. This reflected a larger trend all along the supply chain with many companies moving away from vertical integration as, consequently, the foundry model grew. "This was mainly driven by cost consideratio... » read more

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