category: Whitepapers

category: IoT, Security & Automotive

Uncovering Instabilities In Variational-Quantum Deep Q-Networks
By Fraunhofer IIS/EAS - 07 Jun, 2023 - Comments: 0

By Maja Franz (1), Lucas Wolf (1), Maniraman Periyasamy (2), Christian Ufrecht (2), Daniel D. Scherer (2), Axel Plinge (2), Christopher Mutschler (2), Wolfgang Mauerer (1,3) (1) Technical University of Applied Sciences, Regensburg, Germany, (2) Fraunhofer-IIS, Fraunhofer Institute for Integrated Circuits IIS, Division Positioning and Networks, Nuremberg, Germany, (3) Siemens AG, Corporate ... » read more

Arm SystemReady Certification System Requirements Specification v2.1
By Arm - 07 Jun, 2023 - Comments: 0

Systems that are designed to “just work” for the end user (with the ability to install and run generic off-the-shelf operating systems out-of-the-box) need to follow a set of minimum hardware and firmware requirements to ensure compatibility. For hardware, the Arm SystemReady Program defines a common Base System Architecture (BSA) specification and a set of market-specific supplements. F... » read more

Full Wafer OCD Metrology
By Nova - 06 Jun, 2023 - Comments: 0

Authored by: Daniel Doutt*a, Ping-ju Chena, Bhargava Ravooria, Tuyen K. Trana, Eitan Rothsteinb, Nir Kampelb, Lilach Tamamb, Effi Aboodyb, Avron Gerb, Harindra Vedalac ABSTRACT Optical Critical Dimension (OCD) spectroscopy is a reliable, non-destructive, and high-throughput measurement technique for metrology and process control that is widely used in semiconductor fabrication facilities (f... » read more

MEMS Device Cleaning
By Bruker - 06 Jun, 2023 - Comments: 0

Cleaning is an essential process for MEMS applications in order to prevent device failure due to foreign material. Small particles located on MEMS devices are significant causes of device rejection and yield loss. These issues affect inertial devices, such as accelerometers and gyroscopes, as well as microphones, laser bars and other MEMS devices. Click here to download. » read more

Modular FPGA Makes FPGA Easier To Use
By Flex Logix - 31 May, 2023 - Comments: 0

Traditionally FPGAs are configured once at boot/power-on. This is because they almost always store the configuration file in a Flash memory which is updated from time to time (like your smart phone’s OS and apps). But eFPGA is in your SoC, so you can provide the configuration files from on chip SRAM, on chip NVM and/or off chip DRAM. EFLX eFPGA is reconfigurable. Process nodes like 40nm... » read more

HBM3 And GDDR6: Memory Solutions For AI
By Rambus - 31 May, 2023 - Comments: 0

AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3 and GDDR6... » read more

Accelerating Development of Software Defined Vehicles with Virtual ECUs
By Synopsys - 31 May, 2023 - Comments: 0

The automotive industry is going through a revolution. To adapt to new customer demands such as convenience, safety, autonomy, and electrification, the automotive industry is moving to software-driven vehicles. These require new, more powerful electrical/electronic (E/E) architectures and significantly increase the vehicle software content. They also force the industry to move from lengthy deve... » read more

Understanding And Overcoming The Challenges Of Building High Voltage Automotive Battery Management Systems
By Infineon - 30 May, 2023 - Comments: 0

By Mahmoud Ismail, Patrick Leteinturier, Felix Weidner, Markus Ekler, Klaus Scheibert, Noopuran Sivaguru, Jutta Heinzelmann, Kishore Sukumar In this paper we will discuss challenges associated with developing an automotive battery management system (BMS). We will start with a general introduction to Li-ion batteries, why they are the best choice for automotive applications, and why they nee... » read more

Distribution Of Currents In Via Arrays
By Siemens EDA - 24 May, 2023 - Comments: 0

It has become increasingly difficult in recent years to provide adequate PDNs on a PCB. The sheer number of different voltages, combined with increased current demands, makes distributing current around the board a substantial layout challenge. This paper demonstrates that by using appropriate and accurate simulations, combined with the improved intuition that such simulations bring, it is a ch... » read more

Architectural Considerations For Compute-In-Memory In AI Inference
By Expedera - 24 May, 2023 - Comments: 0

Can Compute-in-Memory (CIM) bring new benefits to AI (Artificial Intelligence) inference? CIM is not an AI solution; rather, it is a memory management solution. CIM could bring advantages to AI processing by speeding up the multiplication operation at the heart of AI model execution. To read more, click here. » read more

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