Moving Intelligence To The Edge


The buildout of the edge is driving a slew of new challenges and opportunities across the chip industry. Sailesh Chittipeddi, executive vice president at Renesas Electronics America, talks about the shift toward more AI-centric workloads rather than CPU-centric, why embedded computing is becoming the foundation of all intelligences, and the importance of software, security, and user experience ... » read more

1.6 Tb/s Ethernet Challenges


Moving data at blazing fast speeds sounds good in theory, but it raises a number of design challenges. John Swanson, senior product marketing manager for high-performance computing digital IP at Synopsys, talks about the impact of next-generation Ethernet on switches, the types of data that need to be considered, the causes of data growth, and the size and structure of data centers, both in the... » read more

Working With RISC-V


RISC-V is coming on strong, but working with this open-source processor core isn't as simple as plugging in a commercial piece of IP. Zdenek Prikryl, CTO at Codasip, talks about utilizing hypervisors and open source tools and extensions to the RISC-V instruction set architecture, where design teams can run into problems, what will change as the architecture becomes more mature, the difference b... » read more

EDA In The Cloud


Hagai Arbel, CEO of Vtool, talks with Semiconductor Engineering about the benefits of moving EDA tools to the cloud, why it has been slow to take off, and what will drive this trend in the future. » read more

Next-Gen SerDes Roadmap


An explosion in data is causing a series of successive bottlenecks in the data center. Priyank Shukla, product marketing manager for high-speed SerDes IP at Synopsys, digs into the performance roadmap for moving data within server racks and between different racks, where the bottlenecks are today, and how they will be addressed in the future. Related SerDes Knowledge Center Top stories... » read more

Next-Gen Design Challenges


As more heterogeneous chips and different types of circuitry are designed into one system, that all needs to be simulated, verified and validated before tape-out. Aveek Sarkar, vice president of engineering at Synopsys, talks with Semiconductor Engineering about the intersection of scale complexity and systemic complexity, the rising number of corners, and the reduced margin with which to buffe... » read more

Better Quality RTL


How do you measure the quality of RTL? Philippe Luc, director of verification at Codasip, talks about identifying bugs, improving the overall quality of the verification, what happens when different blocks are used in a design, and how to improve efficiency in the verification process. » read more

High-Speed SerDes At 7/5nm


Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how to optimize PHYs for integration on all four corners of an SoC, as well as the PPA implications of moving large amounts of data across and around a chip. » read more

Rising Packaging Complexity


Synopsys’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow. » read more

Speeding Up Verification Using SystemC


Brett Cline, senior vice president at OneSpin Solutions, explains how adding formal verification into the high-level synthesis flow can reduce the time spent in optimization and debug by about two-thirds, why this needs to be done well ahead of RTL, starting with issues such as initialization, memory out of bounds and other issues that are difficult to find in simulation. » read more

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