Multi-Die Verification


Chiplets offer unprecedented flexibility in high-performance designs, but they also add new challenges on the verification side. Changing out a chiplet, or adding a new one, can mean having to re-verify an entire multi-die system, a problem that becomes even more complicated if those chiplets are developed by different vendors. Paul Graykowski, director of product marketing at Cadence Design Sy... » read more

Benefits And Challenges Of Using Chiplets


The move to chiplets opens the door to more features than can be packed into a reticle-sized SoC. That potentially means more processing power, simpler designs, and higher yields. But it's not as simple as swapping LEGO blocks into a chassis. Ashley Stevens, director of product management and marketing at Arteris, talks with Semiconductor Engineering about the challenges of using coherent versu... » read more

Inside Chips Podcast: Data Movement In The AI Age


AI is all about data movement — lots of it. The key is to move data as little as possible, and when it is moved, to do it efficiently, securely, and blindingly fast. Semiconductor Engineering talks with Arteris CEO Charlie Janac in this one-on-one discussion about the impact of AI on networks on chip and what will change going forward. To listen to the podcast, click here. » read more

Accelerating IP Reuse


Semiconductors are no longer monolithic designs developed by a single company. There is more third-party IP from different sources — as many as 1,000 different IPs in a complex SoC — and all of that needs to be integrated and work as one system, something that can require a lot of effort and time. Insaf Meliane, product management and marketing director at Arteris, talks about how the new v... » read more

Agentic AI In Chip Design


Large language models (LLMs) like ChatGPT are just the starting point for generating content with AI. The next phase will be about harnessing LLMs with agents, providing automated feedback and improvements in performance and accuracy. Mehir Arora, backend engineer at ChipAgents, talks about the impact this can have on EDA and chip design, allowing smaller teams to compete with larger teams, and... » read more

Optical Interconnectivity At 224 Gbps


AI is generating so much traffic that traditional copper-based approaches for moving data inside a chip, between chips, and between systems, are running out of steam. Just adding more channels is no longer viable. It requires more power to drive signals, and the distance those signals can travel without excessive loss is shrinking. Mike Klempa, product marketing specialist at Alphawave Semi, di... » read more

Speeding Up Die-To-Die Interconnectivity


Disaggregating SoCs, coupled with the need to process more data faster, is forcing engineering teams to rethink the electronic plumbing in a system. Wires don't shrink, and just cramming more wires or thicker wires into a package are not viable solutions. Kevin Donnelly, vice president of strategic marketing at Eliyan, talks about how to speed up data movement between chiplets with bi-direction... » read more

What’s Changing In SerDes


SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product marketing manager at Alphawave Semi, talks about the impact of faster data movement on the transmitter (more power) and on the receiver (gain and advanced equalization), how to ensure signal inte... » read more

Optimizing Data Movement In SoCs And Advanced Packages


The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors everywhere. There may be hundreds of IP blocks, more compute elements, and many more wires to contend with. Andy Nightingale, vice president of product management and marketing at Arteris, talks about the demand for low-latency on-chip communication in increasingly complex ... » read more

Scenario Coverage In Formal Verification


A rapid increase in complexity with heterogeneous assemblies and advanced-node chips is raising all sorts of questions on the formal verification side about the completeness of coverage. Engineers may assume proofs are complete, but in many cases they're black boxes that provide little or no insights into what's actually being proven. This is where scenario coverage comes into play. Ashish Darb... » read more

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