Side-Channel Risks Across 2.5D/3D Integration and Chiplet-Based Systems (Grenoble INP – UGA et al.)


Researchers from Grenoble INP - UGA, CNRS, TIMA have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”. Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, a... » read more

A Fundamental Rethinking Of Memory Hierarchy Design (Stanford University)


A new technical paper titled "The Future of Memory: Limits and Opportunities" was published by researchers at Stanford University and an independent researcher. Abstract "Memory latency, bandwidth, capacity, and energy increasingly limit performance. In this paper, we reconsider proposed system architectures that consist of huge (many-terabyte to petabyte scale) memories shared among large ... » read more