tag: ARM

The Week In Review: Design
By Jesse Allen - 22 Dec, 2017 - Comments: 0

Altium released the latest version of its PCB design suite. Improvements include a new interface and an upgrade to 64-bit architecture combined with multi-threaded task optimizations. Other additions include a new BoM rule checker and length tuning and pin-swapping in the user-guided routing engine. Creonic announced a new line of IP for 5G forward error correction. The product line covers t... » read more

Mixing Interface Protocols
By Ann Mutschler - 21 Dec, 2017 - Comments: 0

Continuous and pervasive connectivity requires devices to support multiple interface protocols, but that is creating problems at multiple levels because each protocol is based on a different set of assumptions. This is becoming significantly harder as systems become more heterogeneous and as more functions are crammed into those devices. There are more protocols that need to be supported to ... » read more

Using Streamline With Fast Models And Fixed Virtual Platforms
By Ronan Synnott - 21 Dec, 2017 - Comments: 0

In a previous blog I wrote about the Fastline plugin developed for Arm Fast Models, and how it can be used with the Streamline performance analyzer. With the recent release of DS-5 5.28, we have enhanced this experience, including all necessary files within the DS-5 installation, and built-in setup wizards to make it easier to set up and configure. In this blog I will take you through t... » read more

Custom Vs. Non-Custom Design
By Ed Sperling - 21 Dec, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss custom designs with Yong Pang, head of North American operations for [getentity id="22217" e_name="Imec"]; Phil Burr, director of portfolio product management for [getentity id="22186" e_name="Arm's"] embedded and automotive groups; Ambar Sarkar, chief technologist at eInfochips; and John Tinson, vice president of sales at Sondrel. What follows are ... » read more

HPC Case Study: CFD Applications On ARM
By Arm - 20 Dec, 2017 - Comments: 0

In this paper, we examine the readiness and potential of ARM-based platforms for High Performance Computing, and have benchmarked two different computational fluid dynamics (CFD) applications. CFD represents one of the most widely used HPC applications in aerospace, automotive and other engineering areas such as turbine-design. For server hardware, we leverage the ThunderX platform from Cavium,... » read more

The Trouble With Models
By Ed Sperling - 20 Dec, 2017 - Comments: 0

Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

Blog Review: Dec. 20
By Jesse Allen - 20 Dec, 2017 - Comments: 0

Mentor's Andrew Macleod points out five things that need to happen for autonomous and electric cars to move from R&D and test cases to mass-produced, commercially viable vehicles. Synopsys' Iain Singleton provides some tips on tackling large designs with formal and how the assume-guarantee technique helps split them without masking bugs. Cadence's Paul McLellan shares updates from the... » read more

Blog Review: Dec. 13
By Jesse Allen - 13 Dec, 2017 - Comments: 0

Mentor's Sherif Hany notes that pattern matching isn't just for litho hotspots anymore, and is increasingly being used in a wide range of early design phase checks, DRC flows, layout retargeting and fixing and DFM checks. Synopsys' Eric Huang explains why USB cables have gotten so short, even though no length is mentioned in the specification. Cadence's Paul McLellan listens in as Jeremy ... » read more

The Week in Review: IoT
By Jeff Dorsch - 08 Dec, 2017 - Comments: 0

Products/Services Vancouver, B.C.-based Riot Micro has brought out the RM1000 baseband modem chip for the cellular Internet of Things. The device is said to use Bluetooth Low Energy and Wi-Fi techniques to provide low-power and lower-cost connectivity, like short-range wireless systems. The chip is being marketed to module manufacturers and OEMs developing narrowband IoT and LTE-M products for... » read more

Hyperscaling The Data Center
By Kevin Fogarty - 07 Dec, 2017 - Comments: 1

Enterprise data centers increasingly will look and behave more like slimmed-down versions of hyperscale data centers as chipmakers and other suppliers adapt systems developed for their biggest customers to in-house IT faciilities. The new chips and infrastructure that will serve as building blocks in these facilities will be more power-efficient, make better use of space and generate less he... » read more

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