Redefining The Power Delivery Network


Reliably getting power around a package containing multiple dies, potentially coming from multiple sources, or implemented in diverse technologies, is becoming much more difficult. The tools and needed to do this in an optimized manner are not all there today. Nevertheless, the industry is confident that we can get there. For a single die, the problem has evolved slowly over time. "For a ... » read more

Preparing For A Barrage Of Physical Effects


Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

Problems And Solutions In Analog Design


Advanced chip design is becoming a great equalizer for analog and digital at each new node. Analog IP has more digital circuitry, and digital designs are more susceptible to kinds of noise and signal disruption that have plagued analog designs for years. This is making the design, test and packaging of SoCs much more complicated. Analog components cause the most chip production test failures... » read more

Open-Source Verification


Ask different people what open-source verification means and you will get a host of different answers. They range from the verification of open-source hardware, to providing an open-source verification infrastructure, to providing open-source stream generators or reference models, to open-source simulators and formal verification engines. Verification is about reducing risk. "Verification is... » read more

Computational Software: The Foundation Across Software Disciplines


You may have seen the term "computational software" more often recently. What are some prominent examples? Why do we in the electronic design automation (EDA) industry have to deal with math in the first place? Wasn't chip design all about drawing polygons at one point? I’m glad you asked! Computational software supports and manages the complexity of fundamental industry trends—hyperscal... » read more

EDA On Board With New Package Options


A groundswell of activity around multi-die integration and advanced packaging is pushing EDA companies to develop integration strategies that speed up time to sign-off, increase confidence that a design will work as expected, while still leaving enough room for highly customized solutions. Challenges range from how to architect a design, how to explore the best options and configurations, ho... » read more

3 Types Of AI Hardware


As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

EDA Strong, M&A Activity Up


The EDA industry is faring well in an era of COVID-19 and global uncertainty, and the numbers prove it. But the question being asked privately by a number of executives across the industry is whether growth will hold up beyond the first quarter of next year if a vaccine or treatment isn't ready. There are a lot of financial models based upon a variety of developments, and so far there is lit... » read more

Vtech: Bus Performance, FPGA Debug


It has been a long time since I was able to talk about a new verification company, but today I can introduce you to Verification Technology, or Vtech for short. If you do a search for them, you will probably find a company that sells baby monitors and kids toys. This is not that company. So, let's make sure you have the right web address to start with https://vtech-usa.com/ or https://vtech-inc... » read more

Gaps Emerging In System Integration


The system integration challenge is evolving, but existing tools and methods are not keeping up with the task. New tools and flows are needed to handle global concepts, such as power and thermal, that cannot be dealt with at the block level. As we potentially move into a new era where IP gets delivered as physical pieces of silicon, this lack of an accepted flow will become a stumbling block. ... » read more

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