tag: Intel

CMOS 2.0: Layered Logic For The Post-Nanosheet Era
By Gregory Haley - 24 Jul, 2025 - Comments: 0

The semiconductor industry has relied on a simple equation for more than five decades — shrink the transistor, pack more onto every wafer, and watch performance soar as costs plummet. While each new node delivered predictable gains in speed, power efficiency, and density, that formula is rapidly running out of steam. As transistors approach single-digit nanometer processes, manufacturing c... » read more

Crisis Ahead: Power Consumption In AI Data Centers
By Ed Sperling - 21 Jul, 2025 - Comments: 2

AI data centers are consuming energy at roughly four times the rate that more electricity is being added to grids, setting the stage for fundamental shifts in where power is generated, where AI data centers are built, and much more efficient system, chip, and software architectures. The numbers are particularly striking for the United States and China, which are in a race to ramp up AI data ... » read more

Chip Industry Week in Review
By The SE Staff - 18 Jul, 2025 - Comments: 0

The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

Data Center CPU Dominance Is Shifting To AMD And Arm
By Geoff Tate - 14 Jul, 2025 - Comments: 0

Fig. 1: Created by ChatGPT from a text prompt. The data center processor market has seen two major tectonic shifts in the last decade. It used to be that all data center compute was x86, and well more than 90% of that was Intel. GPUs first appeared in the data center in 2016 (Pascal GPU). Now, the majority of computation is done on GPUs. AMD is looking to pass Intel in x86 share, and... » read more

Chip Industry Week in Review
By The SE Staff - 03 Jul, 2025 - Comments: 0

[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

Chip Industry Week in Review
By The SE Staff - 27 Jun, 2025 - Comments: 0

AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

Power Delivery Challenges For AI Chips
By Gregory Haley - 19 Jun, 2025 - Comments: 0

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

Are Larger Reticle Sizes On The Horizon?
By Katherine Derbyshire - 19 Jun, 2025 - Comments: 0

Making high-NA EUV lithography work will take a manufacturing-worthy approach to stitching together circuits or a wholesale change to larger masks. Circuit stitching between the exposure fields is challenging the design, yield and manufacturability of the high-NA (0.55) EUV transition. The alternative is a radical change from 6x6-inch to 6x11-inch masks that would eliminate stitching, but it... » read more

TSMC: King Of Data Center AI
By Geoff Tate - 16 Jun, 2025 - Comments: 0

Large language models (LLMs like ChatGPT) are driving the rapid expansion of data center AI capacity and performance. More capable LLM models drive demand and need more compute. AI data centers require GPUs/AI Accelerators, switches, CPUs, storage and DRAM. About half of semiconductors are consumed by AI data centers now. This percentage will be much higher by 2030. TSMC has essentially 1... » read more

Tackling Advanced Chip Manufacturing Challenges
By Christophe Begue - 10 Jun, 2025 - Comments: 0

Intel and PDF Solutions are deepening their partnership to address the growing complexity of semiconductor manufacturing at advanced nodes, according to a recent discussion between Intel CEO Lip-Bu Tan and PDF Solutions CEO John Kibarian at the Direct Connect Intel Foundry event in April. During the presentation, Kibarian highlighted how the two companies have been collaborating for approxim... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy