Encapsulating Wearable Sensors Using A Pre-Mixed Two-Part Epoxy


By Anthony Buzzerio, Venkat Nandivada, and Rohit Ramnath The growing field of wearable medical technology relies heavily on miniaturized sensors capable of providing accurate and continuous physiological data. Ensuring the long-term reliability and performance of these sensors — often subjected to demanding conditions including physical stress, thermal fluctuations, and exposure to bodily ... » read more

Reliability Risks Shift To The Materials Stack


The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

New Trends In Wafer Bonding


Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile devices drives demand for smaller circuit footprints, but the transition isn't always straightforward. Three-dimensional integration schemes take many forms, depending on the required interconne... » read more