Week In Review: Manufacturing, Test


Chipmakers Nvidia is in advanced talks to acquire Arm from Softbank, according to numerous reports. In addition, TSMC and Foxconn are looking at possible investments or stakes in Arm, according to a report from Nikkei Asia Review. Infineon posted mixed results for the third quarter of the 2020 fiscal year. "Infineon has so far coped well with the challenging situation caused by the coronavi... » read more

Blog Review: Nov. 13


Applied Materials' Buvna Ayyagari-Sangamalli argues that the siloed structure that produced the computing eras of the past will not be sufficient to fuel the AI era and that a new codesign approach to everything from architecture to materials is needed. Arm's Wendy Elsasser examines emerging non-volatile memories and how they have triggered innovation for new memory protocols and optimized s... » read more

Inside Panel-Level Fan-Out Technology


Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Electroplating IC Packages


The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. [getentity id="22817" e_name="Applied Materials"]  recently rolled out an ECD system for IC packaging. In addition, Lam Research, TEL and others compete in the growing but competitive ECD equipment market for packaging. ECD—sometimes referred to as pl... » read more