Manufacturing Bits: May 6

By Mark LaPedus - 06 May, 2019 - Comments: 0

Ionic memory Sandia National Laboratories, Stanford University and the University of Massachusetts at Amherst have developed an ionic floating-gate memory array (IFG) for neuromorphic computing. For some time, the industry has been working on neuromorphic computing. The goal of neuromorphic computing is to replicate the brain in silicon. In a neuromorphic chip, the goal is to mimic the way ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 26 Apr, 2019 - Comments: 0

Internet of Things Wing received an Air Carrier Certification from the Federal Aviation Administration to begin making commercial deliveries with drones. The Alphabet unit is cleared to deliver packages in southwestern Virginia. Wing has had a pilot program going in the vicinity of Canberra, Australia, and was recently permitted to make commercial deliveries with unmanned aerial vehicles in th... » read more

Manufacturing Bits: July 25

By Mark LaPedus - 25 Jul, 2017 - Comments: 0

Metrology for the intelligence community The semiconductor industry continues to move full speed ahead with traditional chip scaling. There are several challenges in the arena. One of the big but lessor known challenges is metrology. Metrology, the science of characterizing and measuring films and structures, is becoming more complex, challenging and expensive at each node. Looking to solv... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Central Intelligence Agency

Manufacturing Bits: May 6

Week in Review: IoT, Security, Auto

Manufacturing Bits: July 25

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