tag: Cisco

An Insider’s Guide To Planar And 3D DRAM
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to talk about planar DRAMs, 3D DRAMs, scaling and systems design with Charles Slayman, technical leader of engineering at network equipment giant Cisco Systems. What follows are excerpts of that conversation. SE: What types of DRAM do network equipment OEMs look at or buy these days? Slayman: When we look at DRAM, we look at it for networking applicatio... » read more

Power/Performance Bits: Jan. 5
By Jesse Allen - 05 Jan, 2016 - Comments: 0

A foggy consortium Scientists at Princeton University, ARM, Cisco, Dell, Intel, and Microsoft formed a global effort to develop architectures and tools to further "fog computing" and networks, which aim to harness connected devices' own computing, sensing and storage power to form edge networks that meet most of the demand of user devices that are at the periphery of a more centralized netwo... » read more

MEMS: Flexible, Reusable Platforms Facilitate Innovation
By Paula Doe - 07 Dec, 2015 - Comments: 0

As the game-changing enabler for whatever the emerging market of widespread fragmented intelligence turns out to look like, the MEMS sector is in some ways the bellwether for much of the greater semiconductor/components supply chain looking to rethink how to serve a wider range of fragmented applications with lower costs and faster time to market. Leaders from Cisco, InvenSense, Nasiri Ventures... » read more

Intelligent Autonomous IoT
By Brian Derrick - 03 Dec, 2015 - Comments: 0

Last month I discussed what new markets and winners IoT would produce. Sensors and devices, the edge, server chips and the cloud, are obvious winners. However, it’s not so clear who the winner is in the middle, the realm of gateways and embedded software. These technologies are critical to connecting existing infrastructure to the world of IoT and enabling a whole new category of IoT solution... » read more

The Challenge Of Fitting In
By Ann Mutschler - 30 Nov, 2015 - Comments: 0

Connections between players in the semiconductor industry are becoming critical for survival. Whether the focus is a connected car, home automation, health care or the energy grid, each company in each of those markets relies on others to build useful products. There are several forces at work here. One is an emphasis on connecting everything, regardless of whether it is inside a single vert... » read more

What Markets And Winners Will IoT Produce?
By Brian Derrick - 05 Nov, 2015 - Comments: 0

IoT is trending. However, a consistent definition of IoT can be tough to find in the deluge of marketing, which often overlooks the fact that Internet-connected devices have been around for decades. Many established tech companies have developed and deployed a wide variety of products, both building out the IoT and beginning to define it. Intel in particular has published a slew of excellent vi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Oct, 2015 - Comments: 0

Is the sky falling in the IC equipment market? Not yet, but watch out below. Semi capital spending is expected to reach $60.37 billion in 2015, down 1% from 2014, according to Pacific Crest Securities. “Although we trimmed 2016 capex three weeks ago, we are trimming some more. We now see semiconductor capex down 4% in 2016. However, we do not see capex falling off a cliff in 2016 (i.e., down ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 25 Sep, 2015 - Comments: 0

Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing center. Is 5G the next big thing in wireless? Verizon–the first company to introduce 4G LTE–is once again poised to usher in a new era with an aggressive roadmap for fifth-generation, or 5G, wireless t... » read more

Appetite For Services Grows
By Ed Sperling - 11 Sep, 2015 - Comments: 0

Semiconductor service revenues have been growing for the past year, fueled by complex thermal and power issues at advanced nodes, the difficulty of integrating more and more IP blocks, and far more techniques, languages and methodologies that engineers need to learn to be productive in the finFET generation. The services business typically acts as a bridge between down and up cycles in the c... » read more

New Metrics For The Cloud
By Ed Sperling - 10 Sep, 2015 - Comments: 0

Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

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