Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)


A new technical paper titled "DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design" was published by researchers at Intel Corporation, University of California, Santa Barbara and Cadence. Abstract "Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator ... » read more