Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)


A new technical paper titled "Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging" was published by researchers at National Yang Ming Chiao Tung University. Abstract "This work investigates the thermal stability of Cu-Cu bonding using a thin Ag passivation layer in applications targeting advanced packaging. Co... » read more

Ammonia Plasma Surface Treatment for Improved Cu–Cu Bonding Reliability


A new technical paper titled "Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection" was published by researchers at Myongji University. Abstract "With the emergence of 3D stacked semiconductor products, such as high-bandwidth memory, bonding-interface reliability cannot be overemphasized. The condition of the surface interface befo... » read more