Week In Review: Design, Low Power

By Jesse Allen - 07 Feb, 2020 - Comments: 0

Presto Engineering, an outsourced operations provider to semiconductor and IoT device manufacturers, acquired the DELTA Microelectronics business unit of FORCE Technology. The acquisition adds DELTA's ASIC design and manufacturing to its portfolio. The two companies will retain a strong relationship: FORCE Technology has become a shareholder of Presto Engineering and Juan Farré, FORCE’s CTO,... » read more

The Week in Review: IoT

By Jeff Dorsch - 23 Feb, 2018 - Comments: 0

Finance Vectra raised $36 million in Series D funding led by Atlantic Bridge Capital. The Ireland Strategic Investment Fund and Nissho Electronics also participated in this funding round along with returning investors Khosla Ventures, Accel Partners, IA Ventures, AME Cloud Ventures, DAG Ventures, and Wipro Ventures, bringing Vectra’s total funding to date to $123 million. Vectra will use the... » read more

The Week In Review: Design

By Jesse Allen - 03 Nov, 2017 - Comments: 0

M&A Synopsys will acquire Black Duck Software, a provider of software for securing and managing open source software. Synopsys already has a stake in this area from its Coverity acquisition in 2014, which it has been using to analyze security practices in open source software. Founded in 2003 and headquartered in Massachusetts, Black Duck's products automate the process of identifying and ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DecaWave

Week In Review: Design, Low Power

The Week in Review: IoT

The Week In Review: Design