Challenges For Future Fan-Outs


The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1┬Ám line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more