The Future Of Moore’s Law


Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

Securing EDA In The Cloud


In the first part of this article, EDA’s Clouded Future, the types of application suitable for cloud-based solutions were examined and the cost benefits that could arise for both EDA suppliers and consumers. Security has stood in the way of widespread adoption, but it is a little more complex than just being concerned about a theft of sensitive design data. Security involves data protect f... » read more

Making Hardware Design More Agile


Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

Prototyping To Help You Win The Battle


Lately, my children and I are closely following a new show on ABC called “Battlebots”. The concept is as simple as it is cool—have a massive bulletproof arena where two remote-controlled robots battle it out until one is knocked out or the time is up (and a jury decides the winner). The battles are all about making physical contact with the other robot to either directly deal them damage ... » read more

Rethinking Manufacturing Models


The perennial uncertainty surrounding EUV lithography and complications stemming from the most advanced nodes are creating a domino effect across the semiconductor industry. Rather than stalling the market, though, which is what happened with the transition to 20nm, vendors now are accelerating their product rollouts and adjusting business plans to capitalize on those delays. That includes m... » read more

Ensuring Optimal Performance For Physical Verification


By accessing the most recently qualified version of foundry rule files, users get the most efficient rule implementations. By adopting the most recent version of Calibre, users get the latest improvements in available operations, operation performance, data hierarchy optimization and total scaling, providing the best possible performance and minimizing runtimes. Design teams running full-chip D... » read more

The Future Of Moore’s Law


Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Charlie Cheng, CEO of [getentity id="22135" e_name="Kilopass Technology"... » read more

Tale Of Two HLS Viewpoints


The Design Automation Conference attracts several co-located conferences, symposiums and other such gathering of people, often on more specialized topics than would appeal to the general DAC attendees. Some of them are more research-focused, but one conference is somewhat strange in that it is about a subject that has transitioned to commercial tool development and yet still remains an active a... » read more

IP Integration Challenges Increase


Semiconductor Engineering sat down with Chris Rowen, CTO of [getentity id="22032" e_name="Cadence"]'s IP group; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and mixed-signal IP at [getentity ... » read more

EDA Sales Strong Again


EDA and IP sales were robust again in Q1, up 7.5% to $1.877 billion compared with $1.746 billion in the same period in 2014, according to the EDA Consortium. On the upside, IP revenue rose 19.3% to $618.1 million; services revenue increased 6.8% to $104.4 million; and PCB and multi-chip module revenue increased 1.1% to $161.5 million. On the downside, CAE—the largest single category—... » read more

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