What’s After 5G

By Bryon Moyer - 20 Jul, 2020 - Comments: 1

This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This is far from trivial. 5G only just recently entered the commercial world, and — especially with the higher millimeter-wave (mmWave) frequencies — it has ... » read more

Bottlenecks For Edge Processors

By Ed Sperling - 09 May, 2019 - Comments: 0

New processor architectures are being developed that can provide two to three orders of magnitude improvement in performance. The question now is whether the performance in systems will be anything close to the processor benchmarks. Most of these processors doing one thing very well. They handle specific data types and can accelerate the multiply-accumulate functions for algorithms by distri... » read more

Racing To The Edge

By Susan Rambo And Ed Sperling - 09 Apr, 2019 - Comments: 0

The race is on to win a piece of the edge, despite the fact that there is no consistent definition of where the edge begins and ends or how the various pieces will be integrated or ultimately tested. The edge concept originated with the Internet of Things, where the initial idea was that tens of billions of dumb sensors would communicate through gateways to the cloud. That idea persisted unt... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: edge cloud

What’s After 5G

Bottlenecks For Edge Processors

Racing To The Edge