Advancements in Corona Noncontact Metrology Tools, CnCV, for Industrial WBG Wafer Testing and Electrical Defect Related Yield Prediction


In this review we discuss two recent CnCV metrology advancements, namely: 1. enhancement of throughput and 2. use of electrical defect mapping for yield prediction. Novel 10x faster measurements of critical WBG semiconductor electrical parameters are based on the discovery of a linear UV radiation induced electrical charge biasing.  Example results for an AlGaN/GaN HEMT structure illus... » read more