Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Sep, 2018 - Comments: 0

Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

Preparing For AI

By Katherine Derbyshire - 03 May, 2018 - Comments: 0

Suppose an autonomous car is coming up an on-ramp onto a bridge. The ramp is fine, but the bridge is icy, and there’s an overturned bus full of children blocking several lanes. Children are evacuating through the windows and milling around on the pavement. There isn’t time to stop, even with the better-than-human reaction time an autonomous car might have. Swerving to one side might send... » read more

Systems Bits: Feb. 27

By Ann Mutschler - 27 Feb, 2018 - Comments: 0

Prepare to prevent malicious AI use According to the University of Cambridge, 26 experts on the security implications of emerging technologies have jointly authored a ground-breaking report thereby sounding the alarm about the potential malicious use of artificial intelligence (AI) by rogue states, criminals, and terrorists. The report forecasts rapid growth in cyber-crime and the misuse of... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Electronic Frontier Foundation

Week in Review: IoT, Security, Auto

Preparing For AI

Systems Bits: Feb. 27