AFM-Based Protocol for Characterizing the Incipient Stages of Plasticity on Hybrid Bonding-Ready Copper Pads (NIST, Intel, Colorado School of Mines)


A new technical paper titled "Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy" was published by researchers at the National Institute of Standards and Technology, Intel, and Colorado School of Mines. Excerpt  "The slowdown of Moore’s law has elicited a paradigm shift whereby shrinking of in-plane dim... » read more

3DICs: Atomic-Scale Behavior of Electromigration in Cu−Cu Joints (NYCU, ITRI)


A new technical paper titled "In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density" was published by researchers at National Yang Ming Chiao Tung University (NYCU) and the Industrial Technology Research Institute (ITRI). Excerpt "Electromigration (EM) poses significant challenges to the reliability of miniaturized devices, particularly th... » read more