Overcoming The Limits Of Scaling

By Ed Sperling - 14 Dec, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the increasing reliance on architectural choices for improvements in power, performance and area, with [getperson id="11425" comment=" Sundari Mitra"], CEO of [getentity id="22535" comment="NetSpeed Systems"]; Charlie Janac, chairman and CEO of [getentity id="22674" e_name="Arteris"]; [getperson id="11032" comment="Simon Davidmann"] CEO of [getentit... » read more

The Week In Review: Design/IoT

By Jesse Allen - 17 Jul, 2015 - Comments: 0

Acquisitions Synopsys acquired all low power wireless IP assets of Silicon Vision. The Egyptian company, which provided Bluetooth Smart, ISM Radio, Zigbee Radio, and Z-wave IP, is now working exclusively with Synopsys. The acquisition expands Synopsys' portfolio of IP for the Internet of Things, which includes security IP recently obtained through the acquisition of Elliptic Technologies. ... » read more

The Week In Review: Design/IoT

By Jesse Allen - 02 Jul, 2015 - Comments: 0

Synopsys continued its expansion into security with the acquisition of security IP provider Elliptic Technologies. The Canadian company's focus was cryptography cores, security protocol accelerators and processors, Root of Trust embedded security IP modules, secure boot and cryptography middleware as well as content protection IP for integration into SoCs. NXP and Freescale shareholders appr... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Elliptic Technologies

Overcoming The Limits Of Scaling

The Week In Review: Design/IoT

The Week In Review: Design/IoT