tag: Ethisphere

Chip Industry Week In Review

By The SE Staff - 14 Mar, 2025 - Comments: 0

ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Week In Review

By The SE Staff - 08 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 6... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 16 Feb, 2018 - Comments: 0

Fab tools and test Applied Materials reported record revenue and operating profit in its first quarter ended Jan. 28. Compared to the first quarter of fiscal 2017, Applied grew net sales by 28% to $4.20 billion. In the second quarter of fiscal 2018, Applied expects net sales to be in the range of $4.35 billion to $4.55 billion. “AMAT posted F1Q results above guidance as NAND demand, in p... » read more

Trending Articles

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Chip Industry Week in Review

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.

by The SE Staff

AI Agents Need Goals

AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when looking at the entire development flow.

by Brian Bailey

Knowledge Centers
Entities, people and technologies explored

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Global IC Fabs And Facilities Report: 2024

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.

by Liz Allan

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs

A new lithography library brings mask optimization operations to GPUs.

by Thuc Dam

EUV’s Future Looks Even Brighter

Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.

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Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Linear Pluggable Optics Save Energy In Data Centers

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

by Bryon Moyer

Chip Architectures Becoming Much More Complex With Chiplets

Options for how to build systems increase, but so do integration issues.

by Ed Sperling and Ann Mutschler

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

by Bryon Moyer

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

by Jesse Allen

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