Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 May, 2019 - Comments: 0

Internet of Things Paris-based Parrot Drones and five other companies were selected by the Pentagon’s Defense Innovation Unit and the U.S. Army to adapt off-the-shelf commercial drones for combat applications as part of the Army’s Short Range Reconnaissance program. SRR seeks to develop unmanned aerial vehicles that have a flight time of 30 minutes, a range of three kilometers (nearly two ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 02 Nov, 2018 - Comments: 0

Internet of Things The expensive implementation of 5G cellular communications may be justified by the Internet of Things, writes Hatem Zeine, founder and chief technology officer of Ossia, a developer of wireless power technology. Bain & Company forecasts the B2B IoT market will be worth more than $300 billion by 2020. IDC predicts overall IoT spending will hit $1.2 trillion in 2022. Mi... » read more

Faster Commoditization In Cars

By Ann Mutschler - 02 Nov, 2017 - Comments: 0

Sensors are at the heart of assisted and autonomous driving, but even before these devices hit the road the average selling prices of these components will have to fall far enough to be affordable to a mass audience. Achieving economies of scale is what has made the semiconductor industry successful over the past half century. It has enabled semiconductors to proliferate and for electronics ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: First Sensor

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Faster Commoditization In Cars