Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

FPGAs: Automated Framework For Architecture-Space Exploration of Approximate Accelerators


A technical paper titled "autoXFPGAs: An End-to-End Automated Exploration Framework for Approximate Accelerators in FPGA-Based Systems" was published (preprint) by researchers at TU Wien, Brno University of Technology, and NYUAD. Abstract "Generation and exploration of approximate circuits and accelerators has been a prominent research domain exploring energy-efficiency and/or performance... » read more