Chip Industry Week In Review

By The SE Staff - 29 May, 2026 - Comments: 1

ECTC Panel-level packaging, hybrid bonding, new substrates, and fine-pitch interconnects topped the list of advanced packaging technologies at ECTC this week. Among the announcements: ASE launched an automated 310mm × 310mm panel-level packaging production line. Expected to enter production in the first half of 2027, the line is compatible with FOCoS and FOCoS-Bridge pa... » read more

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Advanced Packaging Limits Come Into Focus

Mechanical and process control limits are now shaping what can be manufactured at scale.

by Gregory Haley

Startup Funding: Q1 2026

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

by Jesse Allen

All AI Data Center Interconnects Will Be Optical Within 5 Years

InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics, co-packaged optics, optical circuit switch).

by Geoff Tate

The Sub-2nm Paradox

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.

by Ed Sperling

When Semiconductor Materials Misbehave

The gap between lab performance and fab reality is growing wider as packages grow more complex.

by Gregory Haley

TSMC Tech Symposium 2026, By The Numbers

Foundry rolls out aggressive new roadmap, focusing on area, power, and latency.

by Barry Pangrle

CPO Is Extending The Limits Of What’s Possible In AI Data Centers

Co-packaged optics technology will have a big impact on system power and the cost of data movement.

by Ann Mutschler

Silicon Photonics Lights The Way To More Efficient Data Centers

Optical is the future, but getting there is harder than it looks.

by Katherine Derbyshire

tag: Fraunhofer FMD

Chip Industry Week In Review

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