The Week In Review: IoT

By Jeff Dorsch - 01 Sep, 2017 - Comments: 0

Finance Dublin-based Cubic Telecom has taken in €40 million (about $47.6 million) in Series C funding, bringing its total funding to €75 million (around $89.25 million). Audi Electronics Venture and Qualcomm are existing investors participating in the new round of funding, joined by new investors Ireland Strategic Investment Fund and Valid Soluciones Tecnologicas SAU. Cubic will use the mo... » read more

The Week In Review: IoT

By Jeff Dorsch - 03 Feb, 2017 - Comments: 0

Finance NXP Semiconductors reported its Secure Connected Devices group posted revenue of $569 million in the fourth quarter, a gain of 10% from a year earlier. NXP CEO Richard Clemmer said in a statement, “All major product lines contributed to a seasonally solid quarter.” The chip company reported Q4 revenue of $2.44 billion and 2016 revenue of nearly $9.5 billion. Consortia Bosch, C... » read more

The Week In Review: IoT

By Jeff Dorsch - 27 Jan, 2017 - Comments: 0

Finance Ring, which sells Internet-connected doorbells, security cameras, and other products, received another $109 million in private funding, bringing its total funding to $209 million. DFJ Growth, Goldman Sachs Investment Partners, and Qualcomm Ventures led the Series D round, with participation by Richard Branson and other existing investors. Ring says its products are available in 100 cou... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: FreeWave Technologies

The Week In Review: IoT

The Week In Review: IoT

The Week In Review: IoT