tag: GlobalFoundries

Still Waiting For III-V Chips
By Mark LaPedus - 19 Feb, 2015 - Comments: 0

For years, chipmakers have been searching for an alternative material to replace traditional silicon in the channel for advanced CMOS devices at 7nm and beyond. There’s a good reason, too: At 7nm, silicon will likely run out of steam in the channel. Until recently, chipmakers were counting on III-V materials for the channels, at least for NFET. Compared to silicon, III-V materials provide ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Jan, 2015 - Comments: 0

This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

Tech Talk: Photomask Challenges
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

GlobalFoundries' Bob Pack talks with Semiconductor Engineering about new problems experienced by photomask shops and how does lithography affects it all. [youtube vid=8hJwVhaZhFc] » read more

Next Channel Materials?
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

Chipmakers are making a giant leap from planar transistors to [getkc id="185" kc_name="finFETs"]. Initially, [getentity id="22846" e_name="Intel"] moved into finFET production at 22nm and is now ramping up its second-generation finFETs at 14nm. And the other foundries will enter the finFET fray at 16nm/14nm. So what’s next? Chipmakers will likely extend the finFET architecture to both 10nm... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Jan, 2015 - Comments: 0

Historically, there has been a good correlation between oil prices and worldwide GDP growth, with lower prices correlating to stronger future growth. Given the current forecast for the price of oil in 2015, IC Insights expects oil prices to once again be a “tailwind” for worldwide GDP growth. Intel posted its sales and earnings for the fourth quarter. In 2015, Intel projects that its cap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Jan, 2015 - Comments: 0

China’s ambitious plan in the 1990s to create numerous foundries did not come to fruition. But in 2014, the Chinese government described new semiconductor industry programs that will utilize investments by both the Chinese national government ($19.5 billion) and local government and private equity investors ($97.4 billion). “IC Insights believes that these outlays have the potential to sign... » read more

The Week In Review: Design/IoT
By Ed Sperling - 19 Dec, 2014 - Comments: 0

Deals Sonics won a deal with Korea's Nexell, which will use Sonics' on-chip network technology for customer-specific application processor designs for the consumer and communications markets. Nexell will use the NoC technology with Samsung's 28nm LP high-k/metal gate process. GlobalFoundries and Cadence rolled out an SoC enablement solution using ARM's Cortex-A17 processor in a 28nm super l... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

This announcement could send some shock waves throughout the foundry business. For its baseband chips, Qualcomm uses several foundries, namely GlobalFoundries, Samsung and TSMC. Now, Qualcomm has another foundry partner. China’s Semiconductor Manufacturing International Corp. (SMIC) says that it has fabricated Qualcomm’s 28nm Snapdragon 410 processors. Snapdragon 410 is a processor that int... » read more

Unraveling The Mysteries At IEDM
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

In some respects, the 2014 IEEE International Electron Devices Meeting (IEDM) was no different than past events. The event, held this week in San Francisco, included the usual and dizzying array of tutorials, sessions, papers and panels. On the leading-edge CMOS front, for example, the topics included [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D IC"] chips, III-V materials, [getkc ... » read more

And the Winner is…
By Brian Bailey - 18 Dec, 2014 - Comments: 0

Semiconductor Engineering now has its first full year under its belt, and I have to say it has been an incredible year. Not only did we exceed a million page views in our first year, but we also got started on the Knowledge Center, an endeavor the likes of which has never been attempted in our industry. It is still very young and has a lot of growing up to do, but it is a wonderful start. We wo... » read more

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