The Week In Review: Design/IoT

Sonics wins deal with Nexell; GF and Cadence enable 28nm ARM on SLP; Synopsys working with Imec past 5nm; NXP adds IoT software development platform.

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Deals
Sonics won a deal with Korea’s Nexell, which will use Sonics’ on-chip network technology for customer-specific application processor designs for the consumer and communications markets. Nexell will use the NoC technology with Samsung’s 28nm LP high-k/metal gate process.

GlobalFoundries and Cadence rolled out an SoC enablement solution using ARM‘s Cortex-A17 processor in a 28nm super low power process. The solution relies on a number of Cadence tools for everything from signoff and extraction to physical verification, as well as ARM’s POP IP.

Synopsys and Imec expanded their TCAD collaboration beyond 5nm for nanowires, TFETs and other devices. The two had been working together on finFETs and 3D-IC technologies for 10nm and 7nm. http://news.synopsys.com/2014-12-16-Synopsys-and-Imec-Expand-TCAD-Collaboration-to-5-nm-and-Beyond

NXP uncorked a software development platform for IoT wireless microcontrollers. The software, which was developed by Beyond Semiconductor, improves on code density and reduces development time.