Solving The Last-Mile Delivery Problem

By John Koon - 06 Jul, 2023 - Comments: 0

Retailers are deploying robots to cut costs and improve efficiency, opening new opportunities for chipmakers as well as a host of new challenges. Key to this strategy are autonomous roadside delivery robots (ARDRs). Retailers have been facing razor-thin profit margins for years and have turned their sights to increasing operational efficiency to stay competitive. Solving the last-mile delive... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 13 Sep, 2019 - Comments: 0

Products/Services Arm and Swift Navigation will collaborate on providing technology to developers of autonomous vehicles and connected cars. San Francisco-based Swift Navigation, which offers Global Navigation Satellite System positioning technology for AVs, is teaming with the chip design company to offer Swift’s solutions as an option on Arm-based platforms, the companies say. Swift’s St... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 09 Aug, 2019 - Comments: 0

Products/Services Synopsys agreed to acquire QTronic, a German company specializing in simulation, test tools, and services for automotive software and systems development. The transaction is expected to close in the fourth quarter of the company’s 2019 fiscal year. “The terms of the deal, which is not material to Synopsys financials, are not being disclosed,” Synopsys said in a statemen... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Solving The Last-Mile Delivery Problem

Week in Review – IoT, Security, Autos

Week in Review: IoT, Security, Autos