Startup Funding: July 2023

By Jesse Allen - 02 Aug, 2023 - Comments: 0

Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

Startup Funding: Aug. 2022

By Jesse Allen - 11 Sep, 2022 - Comments: 0

Investors funneled $1.9 billion into startups last month. The total was down from the previous few months for companies tracked by Semiconductor Engineering, but still a strong showing for the chip industry and related technologies. By market segment, power devices were a bright spot in August's funding, with 12 companies receiving new financing rounds. A manufacturer of multilayer ceramic c... » read more

Startup Funding: August 2022 Sortable Funding Chart

By Jesse Allen - 08 Sep, 2022 - Comments: 0

Below is a sortable chart that accompanies your e-book purchase of Semiconductor Engineering's August 2022. Startup Funding report. Simply click on the top headers to determine your primary sort. [table id=52 /] The complete ebook (over 40 pages) can be found here. » read more

Startup Funding: August 2022

By Jesse Allen - 07 Sep, 2022 - Comments: 0

Startup Funding: May 2022

By Jesse Allen - 06 Jun, 2022 - Comments: 0

May was another strong month for China as it continues its push to build a native semiconductor ecosystem. Over half the month's total funding went to startups in the country. Over half the companies funded were from China as well, including two FPGA companies, three making CPUs, a GPU startup, and numerous networking and wireless chip companies. Two of those, in FPGAs and CPUs, raised rounds s... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.