Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 Aug, 2018 - Comments: 1

Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

Display Landscape Heats Up At CES 2016

By Max McDaniel - 21 Jan, 2016 - Comments: 0

I was one of the 170,000+ people who attended the 2016 Consumer Electronics Show in Las Vegas earlier this month and thought I’d share some observations; first, about the consumer technologies on exhibit, and second, about the topic closest to my heart, displays. To learn what technologies were trending, you don’t need to look any further than Intel CEO Brian Krzanich's keynote speech. ... » read more

How Will China Spend $120B?

By Ed Sperling - 22 Oct, 2015 - Comments: 1

It's daunting to consider how much Chinese VC and government money is ready for investment around the globe. With the total now estimated somewhere in the neighborhood of $120 billion, that's a huge stockpile of cash. Just to put that in perspective, roughly $48.3 billion was invested by U.S. investors in 2014, according to a report issued by the National Venture Capital Association and Pricewa... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Haier

Week in Review: IoT, Security, Auto

Display Landscape Heats Up At CES 2016

How Will China Spend $120B?