A new technical paper titled "3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems" was published by researchers at EPFL and Universidad Complutense de Madrid.
Abstract
"The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps w...
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