Week In Review: Manufacturing, Design, Test


The technology of 3D "bioprinting" (the medical application of 3D printing to produce living tissue and organs) is advancing so quickly that it will spark a major ethical debate on its use by 2016, according to Gartner. At the same time, 3D printing of non-living medical devices such as prosthetic limbs, combined with a burgeoning population and insufficient levels of healthcare in emerging mar... » read more

A Perspective On Open Process Specification


It is the job of the Process Design Kit (PDK) engineers to deliver a high-quality PDK that properly represents the process requirements and constraints and supports the design flows used by their customers. The PDK engineer takes multiple inputs describing the process and the devices and circuitry in the process and generates the output in the form of OpenAccess technology libraries (techDB), d... » read more

What’s After CMOS?


Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor could scale at least to the 3nm node in the 2021 timeframe. And then, CMOS could run out of gas, prompting the need for a new switch technology. So what’s after the CMOS-based transistor? Carbon nanotubes and graphene get the most a... » read more

The Week In Review: System-Level Design


India's reliance on technology has created a huge demand for software in the country. IDC expects the market for enterprise software in India to grow 19%, and the market for collaborative applications to grow 13.5%. Growth is continuing across all business markets, turning India into a huge consumer of software rather than just a creator. The enterprise software market in India is dominated by ... » read more

Defining The Next Standard Cell


Synopsys, Intel and IBM all contributed technology to Si2 to create a standard version of parameterized cells, or PCells, for mixed-signal designs. The move is an attempt to smooth out design incompatibilities using Synopsys and Cadence technology. Cadence is the clear market leader in this space. But as more technology is developed using different vendors'  tools for integration in complex... » read more

What’s After Silicon?


As discussed in the first article in this series, germanium is one of the leading candidates to succeed silicon as the channel material for advanced transistors, and has been for several years. The fundamental challenges of germanium integration were detailed at length in 2007. Unfortunately, knowing what the issues are does not necessarily lead to a solution. When a MOSFET transistor turns ... » read more

Manufacturing Bits: Jan. 7


Climbing Terminator Robots Simon Fraser University has developed a family of climbing robots that mimic the stickiness of gecko lizard feet. Based on a “footpad terminator” adhesive technology, the robots could be used in space missions and on Earth. The climbing robot, called Abigaille, features six legs. This allows the robots to crawl on vertical and horizontal structures. The techno... » read more

The Week In Review: System-Level Design


The big buzz at this year’s CES is around wearable computing, according to Gartner, and the big drivers will be fitness and digital health. The firm believes wearable electronics will be peripherals to smartphones, which will provide connectivity to store and analyze biodata. Hewlett-Packard plans to cut 34,000 employees by the end of this year, or roughly 11% of its workforce, according t... » read more

The Week In Review: Manufacturing & Design


Tensions between the U.S. and China are growing. In a research report, Gus Richard, an analyst at Piper Jaffray, said: “The technology sector is being impacted by U.S./Chinese tensions over cybersecurity. The combination of Huawei being blocked from doing business in the United States and the Snowden affair are impacting U.S. tech companies' prospects in China. China’s state-run media ident... » read more

Fastest Computers On The Planet


The latest Green500 list (Excel spreadsheet here) was just released at the end of last month and heterogeneous systems now own the top of the list. The Top 10 systems all use a combination of Intel Xeon (mostly E5) processors paired with NVIDIA K20s. There are now 6 systems listed that have broken the 3,000 MFLOPS/W barrier and TSUBAME-KFC, belonging to the Tokyo Institute of Technology’s GSI... » read more

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